Intelligent Power Module Terminal Segmentation for Control Flexibility
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Solution Overview
Problem
Conventional intelligent power modules (IPMs) require time-consuming and costly changes in control and protection specifications due to the integral packaging of power semiconductor elements, sensor sections, and drive control circuits, limiting flexibility and increasing development time.
Innovation Solution
A semiconductor device with a power semiconductor element, sensor section, and drive terminals that are connectable from outside the case, allowing for separate configuration of the control substrate, enabling independent design and easy modification of control circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the power semiconductor element, sensor section, drive control circuit and protection operation control circuit are integrally accommodated in the package, then the IPM structure is compact and integrated, but the specification changes for control or protection operation become time-consuming and costly
Solution Approach 1:
The patent divides the IPM into two separate parts: a standardized semiconductor device (with power semiconductor element, sensor section, and terminals) and a separate control substrate. This segmentation allows the control substrate to be independently modified for different applications while the semiconductor device remains standardized, enabling easy specification changes without redesigning the entire IPM.
Solution Approach 2:
The semiconductor device is designed with universal characteristics by providing standardized terminals (main electrode terminal, sensor signal terminal, drive terminal) that can connect to different control substrates. This universality allows the same semiconductor device to be used across multiple applications with different control requirements, improving adaptability while maintaining integration benefits.
2Volume of moving object
If the power semiconductor element, sensor section, drive control circuit and protection operation control circuit are integrally accommodated in the package, then the IPM is compact, but changing specifications requires changing each IPM which increases development time
Solution Approach 1:
By segmenting the IPM into a compact standardized semiconductor device and a separate control substrate, the patent maintains the space efficiency of integration while enabling independent development of the control substrate. This reduces development time as control specifications can be modified without affecting the standardized semiconductor device.
3Adaptability or versatility
If the sensor signal terminal and drive terminal are provided so as to be connectable from outside the case, then the control substrate can be separately configured, but the package structure becomes more complex
Solution Approach 1:
The patent extracts the control circuit functions from the semiconductor device package by providing connectable terminals (sensor signal terminal and drive terminal) that extend outside the case. This allows the control substrate to be separately configured and connected, enabling independent design and modification without increasing the core semiconductor device package complexity.
Data Source
AI summary
The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.