IR Wafer Positioning for Broken Wafer and Lift Pin Detection

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Solution Overview

Problem

Current wafer alignment approaches in semiconductor manufacturing are inadequate in predicting physical hazards such as broken wafers or lift pins, leading to potential damage to transfer robots and processing chambers, and prolonged recovery times.

Innovation Solution

A monitoring system using infrared (IR) radiation to take images of the processing chamber interior, evaluating the images for operational or failure states, and activating an interlock to prevent transfer robot damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If top-down view alignment approach is used, then wafer position can be determined, but physical hazards such as broken wafers or lift pins cannot be detected

Engineering Contradiction:

Improvewafer position determinationVSAvoiddetection of physical hazards

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent transitions from a top-down two-dimensional alignment view to a side-view three-dimensional perspective using infrared imaging. This dimensional change enables detection of vertical position deviations, broken wafers, and broken lift pins that are invisible from the top-down view, thereby resolving the contradiction between position determination and hazard detection.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If transfer robot operates without hazard detection, then productivity is maintained, but damage to transfer robot and processing chamber can occur

Engineering Contradiction:

Improveproduction yieldVSAvoiddamage to transfer robot

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The infrared imaging system performs preliminary detection of hazards (broken wafers, broken lift pins, vertical misalignment) before the transfer robot executes its transfer operation. By detecting these hazards in advance and activating interlocks to prevent robot movement, the system maintains productivity by avoiding costly downtime while protecting the robot and chamber from damage.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If real-time monitoring is implemented, then damage prevention is achieved, but system complexity increases

Engineering Contradiction:

Improvedamage preventionVSAvoidmonitoring system structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical monitoring systems with an optical-based infrared imaging system. Instead of using multiple mechanical sensors, switches, or physical detectors throughout the chamber, a single infrared camera captures images that provide comprehensive information about wafer position, lift pin status, and potential hazards, thereby achieving reliable damage prevention with reduced system complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents damage to transfer robots and processing chambers by detecting positional irregularities or failures in real-time, reducing equipment downtime and maintenance costs.

Implementation Method 1

the camera configured to measure infrared radiation from the processing chamber

Methodology Applied

Scientific EffectInfrared radiation: Infrared Radiation

Data Source

PatentUS20260005043A1In-line wafer positioning system using IR imaging

Publication Date: 2026.01.01 APPLIED MATERIALS INC

AI summary

Monitoring system for a semiconductor manufacturing processing tool and methods of monitoring a semiconductor manufacturing process tool are described. The monitoring system has a reflector positioned above a transfer robot in a transfer station of the processing tool. The reflector is configured to direct radiant energy from a processing chamber connected to the transfer station to a camera above the transfer station, the camera configured to measure infrared radiation from the processing chamber.