Irregular Substrate Cutting via Laser Trough and Ultrasonic Breaking
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Solution Overview
Problem
Traditional methods for cutting base substrates of irregular patterns result in cumulative errors and low cutting efficiency due to the need for multiple cuts, leading to reduced accuracy and productivity in display device manufacturing.
Innovation Solution
A method involving forming a cutting line with a photoresist pattern and creating a trough line using laser cutting or etching, followed by applying an ultrasonic force to divide the substrate along the trough line, enhancing accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional numerical control machine tool cutting method is used for irregular pattern substrates, then multiple cutting operations can be performed, but cumulative error increases and cutting accuracy decreases
Solution Approach 1:
The cutting process is segmented into two distinct stages: first forming a trough line using laser or plasma technology to create a separation layer, then applying tensile force to complete the break. This segmentation allows each stage to be optimized independently, achieving both high precision and high efficiency without the cumulative errors of traditional multi-pass mechanical cutting
Solution Approach 2:
The patent replaces traditional mechanical cutting systems with a combination of energy-based technologies (laser or plasma for trough formation) followed by mechanical tension. This substitution eliminates the cumulative positioning errors inherent in repeated mechanical cutting operations while maintaining cutting accuracy through the precision of the energy-based trough formation process
2Manufacturing precision
If multiple cutting operations are performed to achieve irregular patterns, then the desired shape can be obtained, but cutting efficiency becomes very low
Solution Approach 1:
The trough line is formed in advance using laser or plasma technology before the final breaking operation. This preliminary action creates a precise separation path that guides the subsequent break, ensuring both pattern accuracy and high cutting efficiency in a single operation rather than multiple sequential cuts
3Productivity
If traditional cutting methods are used for mass production, then production volume can be increased, but cumulative error and lower accuracy persist
Solution Approach 1:
The patent replaces repeated mechanical cutting with a single operation combining energy-based trough formation (laser/plasma) followed by tensile breaking. This substitution maintains high production efficiency suitable for mass production while eliminating the cumulative positioning errors that degrade accuracy in traditional multi-pass mechanical cutting processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves the accuracy and efficiency of cutting irregular patterns, enabling high-precision substrates suitable for mass production and reducing subsequent processing burdens.
Implementation Method 1
applying an ultrasonic vibration device to the substrate; and dividing the substrate along the trough line with the substrate being vibrated by the ultrasonic vibration
Implementation Method 2
creating a trough line using laser cutting or etching
Data Source
AI summary
A method for cutting a substrate of irregular pattern comprises: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.