Island-Lead Semiconductor Package for Compact High-Voltage Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices designed for higher voltage switching require a larger distance between leads, making them bulky and less compact.
Innovation Solution
A semiconductor device configuration featuring a switching element with offset electrodes, an island lead with distinct surfaces, and terminal leads spaced apart from the island lead, along with a resin member covering parts of the island and terminal leads, allows for higher voltage operation while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between leads is increased to handle higher voltage, then voltage handling capability is improved, but device size increases
Solution Approach 1:
The patent introduces a vertical dimension by stacking the first and second switching elements above and below the island lead, respectively. This three-dimensional arrangement allows sufficient electrical isolation for high voltage operation without increasing the horizontal footprint of the device, thereby resolving the contradiction between voltage handling capability and device size.
Solution Approach 2:
The patent embeds the switching elements within the vertical space above and below the island lead, effectively nesting them in the thickness direction. This nesting approach maximizes the use of available space and achieves compact high-voltage device design by utilizing the vertical dimension rather than expanding horizontally.
2Reliability
If the distance between leads is increased to provide insulation for higher voltage, then insulation reliability is improved, but device complexity increases
Solution Approach 1:
The island lead serves multiple functions: it acts as an electrical connection for the switching elements, provides mechanical support, and functions as a spacing structure that maintains insulation distance. This multi-functionality reduces the need for additional dedicated insulation structures, thereby maintaining insulation reliability while minimizing device complexity.
Solution Approach 2:
The resin member acts as an intermediary material that provides electrical insulation between the terminal leads and the island lead while also providing mechanical support and protection. This single material accomplishes both insulation and structural functions, simplifying the overall device structure while ensuring high insulation reliability for high-voltage operation.
Data Source
AI summary
A semiconductor device includes a switching element, a control element that controls the switching element, an island lead on which the switching element and the control element are mounted, and a plurality of terminal leads. The switching element includes a first electrode, a second electrode and a third electrode, where the first electrode and the second electrode are offset from the third electrode in a first sense of a thickness direction. The island lead has an obverse surface facing in the first sense of the thickness direction and supporting the switching element and the control element. Each terminal lead is electrically connected to the second electrode or the control element. The island lead is spaced apart from the plurality of terminal leads.