Island-Shaped Metal Layer Resist Residue Removal
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Solution Overview
Problem
In organic EL display devices, the close spacing of source lines leads to difficulties in removing film residue during the rework process due to uneven resist film thickness, resulting in reduced effectiveness of the rework process.
Innovation Solution
The implementation of a display device structure where first metal layers are formed in an island shape along adjacent wiring lines, overlapping regions between source lines and other wiring lines, ensuring uniform resist film thickness and reducing residue accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the distances between source lines are shortened for high definition, then the display resolution is improved, but the rework process becomes complicated and resist film residue remains between wiring lines
Solution Approach 1:
A protrusion is formed on the insulating film between adjacent source lines before the rework process. This protrusion serves as a preliminary structural preparation that ensures the resist film can be applied with sufficient thickness during the rework etching process, preventing residue while maintaining the shortened source line spacing required for high definition display.
2Ease of manufacture
If a belt-shaped resist pattern is formed to cover source lines for rework, then the conductive film residue can be removed, but the resist film becomes thin on source lines and thick between them causing residue
Solution Approach 1:
Instead of applying a uniform resist film thickness across the entire substrate, the invention creates a localized protrusion structure on the insulating film between source lines. This local modification ensures that the resist film achieves appropriate thickness in the critical between-line regions where residue prevention is needed, while maintaining proper thickness on the source lines themselves for effective etching.
3Measurement precision
If the resist film is applied thinly on source lines for high definition, then the source line coverage is improved, but the exposure amount is insufficient and film residue remains
Solution Approach 1:
The protrusion structure is formed on the insulating film before resist application, serving as a preliminary action that pre-establishes the topography needed for uniform resist film thickness. This ensures that during the rework process, sufficient resist film thickness is achieved on source lines for complete removal of conductive film residue, while maintaining sharp source line definition for high display resolution.
Data Source
AI summary
A first metal layer that is formed by a first metal film is provided in an island shape along a pair of third wiring lines that is adjacent to each other. The first metal layer overlaps a region that is surrounded by a pair of first wiring lines, among several first wiring lines extending parallel to each other and formed by a first metal film, that is adjacent to each other, and the pair of third wiring lines, among several third wiring lines extending parallel to each other and in a direction intersecting each of the several first wiring lines.