Isocyanurate Polymer Adhesive for Semiconductor Heat Resistance
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Solution Overview
Problem
Existing adhesives and resin materials used in semiconductor device manufacturing and flexible display processes lack sufficient heat resistance and insulation performance, particularly at temperatures above 250°C, and can be hygroscopic, leading to suboptimal results in applications requiring high thermal stability and transparency.
Innovation Solution
A polymer with a weight-average molecular weight of 1,000 to 100,000, comprising specific structural units that provide high heat resistance, transmittance, and adhesiveness, is developed, which can be used in adhesive compositions and insulating film formations, avoiding the use of silicon-based materials that require fluorine gas processing and are prone to hygroscopy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional adhesives (acrylic resin, epoxy resin, silicone resin) are used for bonding in semiconductor manufacturing, then ease of manufacture is improved, but heat resistance deteriorates at temperatures above 250°C
Solution Approach 1:
The patent modifies the chemical structure of isocyanurate ring-containing polymers by controlling the substitution pattern (N-monosubstituted vs N,N′,N′′-trisubstituted) and reaction conditions to achieve optimal heat resistance above 250°C while maintaining adhesive properties for semiconductor bonding applications
Solution Approach 2:
The patent creates composite adhesive materials by combining isocyanurate ring-containing polymer structures with specific molecular weight ranges (1,000-100,000) and controlling the composition to achieve both high heat resistance and adequate adhesiveness for bonding semiconductor elements at elevated temperatures
2Strength
If silicon-based materials are used in the polymer composition, then adhesiveness is improved, but manufacturing complexity increases due to fluorine gas processing requirements
Solution Approach 1:
The patent extracts and eliminates silicon-based materials from the polymer composition, replacing them with alternative structures that provide adequate adhesiveness without requiring fluorine gas processing, thereby simplifying the manufacturing process and eliminating associated complexity
Solution Approach 2:
The patent employs polymer structures with controlled molecular weights (1,000-100,000) that provide sufficient adhesive performance for the application lifecycle without requiring complex silicon-based formulations, enabling simpler processing and elimination of specialized fluorine gas handling infrastructure
3Temperature
If polymer molecular weight is increased to improve heat resistance, then temperature stability is improved, but transmittance deteriorates
Solution Approach 1:
The patent optimizes the molecular weight parameter of the polymer to fall within the specific range of 1,000-100,000, balancing the competing requirements of heat resistance (requiring higher molecular weight) and optical transmittance (requiring lower molecular weight), achieving both properties simultaneously in the cured adhesive composition
Data Source
AI summary
There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1):wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6):wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.