Isocyanuric Ring Polysiloxane for Optical Semiconductor Encapsulation
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Solution Overview
Problem
Current isocyanuric ring-containing polymers face challenges in achieving flexibility, curing properties, compatibility, and low moisture permeability, particularly when used as encapsulating materials for optical semiconductors, due to their rigid structure and poor compatibility with cross-linking agents.
Innovation Solution
An organopolysiloxane with an isocyanuric ring and vinyl siloxy groups at both terminals, represented by a specific molecular formula, is developed, allowing for a cured product with improved mechanical, electrical, and optical properties through a hydrosilylation reaction process involving diallyl isocyanurate, alkoxysilane, and a terminal vinyl-modified organosiloxane, using platinum as a catalyst.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If isocyanuric ring-containing polymers with siloxane bonds in the main chain are used, then flexibility is improved, but compatibility with cross-linking agents deteriorates and curing properties worsen
Solution Approach 1:
The polymer structure is segmented into distinct functional regions: the main chain contains siloxane bonds for flexibility, while the side chains contain isocyanuric rings with alkenyl groups for cross-linking. This segmentation allows each part to perform its specific function without interfering with the other, resolving the contradiction between flexibility and curing properties
Solution Approach 2:
Different parts of the polymer molecule are given different properties: the main chain is designed for flexibility (siloxane bonds), while the side chains are designed for cross-linking (isocyanuric rings with alkenyl groups). This local differentiation allows the material to simultaneously achieve flexibility and good curing properties
2Reliability
If isocyanuric ring-containing polymers with high crosslink density are used, then curing property is improved, but flexibility deteriorates
Solution Approach 1:
The polymer architecture separates cross-linking functions to side chains while keeping the main chain flexible. This segmentation enables high crosslink density without compromising the flexibility of the backbone structure, as the siloxane bonds in the main chain remain intact and flexible
Solution Approach 2:
The polymer combines two distinct structural elements: flexible siloxane-based main chains and rigid isocyanuric ring structures with cross-linking capability. This composite structure allows the material to achieve both high curing density and maintained flexibility through the synergistic combination of different material properties
3Quantity of substance
If polymers with siloxane bonds are used, then gas permeability is improved, but moisture permeability worsens
Solution Approach 1:
The polymer structure is modified by introducing isocyanuric rings with specific alkenyl group configurations that alter the free volume and chain packing. This parameter change in molecular structure enables the material to achieve low moisture permeability while maintaining appropriate gas permeability through controlled molecular arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured product exhibits superior mechanical strength, heat resistance, electrical insulation, chemical resistance, water resistance, and low moisture permeability, making it suitable for optical materials and encapsulating semiconductors, such as LEDs, with enhanced transparency and flexibility.
Implementation Method 1
an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals... which has good flexibility, curing property, compatibility, and optical property
Data Source
AI summary
The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1):wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.