Isolated Air Channel Layout for Dense Electronic Chassis Cooling
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Solution Overview
Problem
High configuration densities in electronic devices lead to uneven heat dissipation, causing overheating and inefficiencies due to airflow mixing and leakage between air channels.
Innovation Solution
The electronic device is designed with independent air channels and cushioning members to isolate airflow, ensuring uniform temperature distribution and preventing airflow mixing, while also providing shock absorption and electrical protection through insulators and folded edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If air channels are arranged close together to increase configuration density, then space utilization is improved, but airflow mixing and leakage occur between channels causing poor heat dissipation
Solution Approach 1:
The patent divides the air channel system into multiple independently isolated channels (first air channel and second air channel) separated by partition plates and cushioning members. This segmentation prevents airflow mixing while maintaining close spacing, allowing each channel to independently dissipate heat from its associated modules without interference from adjacent channels.
Solution Approach 2:
The patent introduces cushioning members as intermediary elements positioned between adjacent air channels and between the board and partition plates. These cushioning members act as mediators that prevent direct contact and airflow leakage between channels while maintaining the compact configuration, effectively isolating airflow paths without requiring large gaps.
2Volume of moving object
If gaps between air channels are reduced to compact the device, then device size is reduced, but air leakage and bypass occur resulting in uneven temperature distribution
Solution Approach 1:
The patent employs thin cushioning members that can be positioned in tight spaces between air channels and between the board and partition plates. These thin flexible barriers effectively block airflow leakage through minimal gaps while maintaining the compact device structure, preventing air bypass without requiring significant spacing between components.
Solution Approach 2:
The patent incorporates cushioning members in advance at critical interfaces where airflow leakage might occur, such as between the board and partition plates, and between adjacent air channels. This preemptive positioning prevents air leakage and bypass before it can cause temperature unevenness, ensuring uniform temperature distribution from the outset.
3Reliability
If partition plates are added to isolate air channels to prevent airflow mixing, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The partition plates serve multiple functions simultaneously: they isolate air channels to prevent airflow mixing, provide mounting surfaces for cushioning members, and act as structural supports within the device. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while maintaining effective air channel isolation.
Solution Approach 2:
The patent combines the isolation function with existing structural components by integrating cushioning members into the partition plate assembly and using the board as both a structural element and a mounting surface for cushioning members. This merging of functions reduces the total number of discrete components needed, simplifying the overall structure while achieving effective airflow isolation.
4Reliability
If cushioning members are added to prevent air leakage and provide shock absorption, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The cushioning members are designed to be self-positioning elements that automatically fill gaps and provide isolation without requiring complex adjustment mechanisms. Their elastic properties allow them to self-adjust to minor dimensional variations, providing both airtightness and shock absorption while simplifying the assembly process through their inherent adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, maintains uniform temperature, and improves electrical reliability by preventing airflow leakage and short circuits, thus optimizing the device's operational efficiency.
Implementation Method 1
the first air channel and the second air channel are isolated by the first partition plate, the board, the first cushioning member, and the middle layer plate
Implementation Method 2
a first fan module and a second fan module, where the first fan module is disposed in the first air channel, and the second fan module is disposed in the second air channel
Implementation Method 3
the first cushioning member is connected to the second surface of the board, and the first cushioning member extends along a width direction of the electronic device; the middle layer plate is fixedly connected to the chassis body, the middle layer plate is further connected to the first cushioning member
Data Source
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AI summary
The present application provides an electronic device, including a chassis body, and a first partition plate, a middle layer plate, a board, and a first cushioning member that are disposed in the chassis body, where an accommodation space of the chassis body includes a first air channel and a second air channel, and the second air channel and the first air channel are sequentially disposed along a height direction of the electronic device; the board is fixedly connected to the chassis, the board extends along the height direction of the electronic device, and the board includes a first surface and a second surface that are disposed facing away from each other; the first partition plate is connected to the chassis body, and the first partition plate is further connected to the first surface; the first cushioning member is connected to the second surface; the middle layer plate is connected to the chassis body, and the middle layer plate is further connected to the first cushioning member; and the first air channel and the second air channel are isolated by the first partition plate, the board, the first cushioning member, and the middle layer plate. The technical solution of the present application ensures good heat dissipation performance of the electronic device.