Electrically Isolated Anode for Sputtering Deposition
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Solution Overview
Problem
Conventional pass-through deposition systems with a moving anode relative to the cathode experience substrate damage and unstable cathode operation due to intermittent electrical contact and arcing between the substrate and the pallet, leading to inconsistent deposition and device failures.
Innovation Solution
A pass-through deposition system with an anode electrically isolated from the substrate wafer, where the anode is maintained in a substantially fixed position relative to the wafer pallet, which moves through the deposition chamber, using insulators to prevent electrical contact and arcing, allowing for consistent deposition and stable cathode operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the wafer pallet and substrates form the primary anode with intermittent electrical contact, then the system structure is simple, but substrate damage occurs and cathode operation becomes unstable
Solution Approach 1:
The system segments the anode function into two separate components: the wafer pallet (which holds and transports substrates) and the dedicated anode component (which provides electrical contact). This segmentation eliminates the harmful intermittent contact between the pallet and substrates while maintaining the necessary electrical circuit for sputtering deposition.
Solution Approach 2:
The patent introduces an intermediary electrical connection mechanism between the wafer pallet and the anode, ensuring consistent electrical contact without requiring direct contact between the pallet and substrate. This intermediary connection stabilizes the electrical circuit while allowing the pallet to move freely.
2Ease of operation
If the wafer pallet acts as the primary anode with intermittent contact, then the system is easier to operate, but substrate damage and material alteration occur
Solution Approach 1:
By separating the mechanical support function (wafer pallet) from the electrical anode function, the system allows the pallet to move easily for loading and unloading substrates without the constraint of maintaining intermittent electrical contact. The dedicated anode component provides stable electrical connection independently of pallet movement.
Solution Approach 2:
The intermediary electrical connection mechanism enables the wafer pallet to move freely for ease of operation while maintaining consistent electrical contact through the dedicated anode component, thereby preventing substrate damage from arcing and intermittent contact.
3Device complexity
If intermittent electrical contact is allowed between substrate and pallet, then the system structure is simpler, but electrical arcing and heat generation occur
Solution Approach 1:
The system segments the electrical circuit into distinct components: the wafer pallet (mechanical support), the dedicated anode component (electrical contact), and the substrate. This segmentation eliminates the formation of metal alloys from arcing and prevents electrical discharge damage to the substrate.
Solution Approach 2:
The intermediary connection between the wafer pallet and anode component ensures consistent electrical contact without requiring direct contact between the pallet and substrate, thereby eliminating electrical arcing and heat generation that would otherwise occur with intermittent contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents substrate damage and ensures consistent deposition by eliminating arcing and metal alloy formation, maintaining the integrity of the deposited material and improving device performance.
Implementation Method 1
The anode is electrically isolated from the substrate wafer... using insulators to prevent electrical contact and arcing
Implementation Method 2
A magnetron enhances this operation by generating strong electric and magnetic fields to trap electrons
Implementation Method 3
A magnetron enhances this operation by generating strong electric and magnetic fields to trap electrons
Implementation Method 4
Sputtering, in general, is the process of ejecting atoms from a solid target material, the target or cathode, to deposit a thin film on a substrate. The ions impact the target and cause target material to eject and deposit on the substrate.
Data Source
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AI summary
A system for substrate deposition. The system includes a wafer pallet and an anode. The wafer pallet has a bottom and a top. The top of the wafer pallet is configured to hold a substrate wafer. The anode has a substantially fixed position relative to the wafer pallet and is configured to move with the wafer pallet through the deposition chamber. The anode is electrically isolated from the substrate wafer.