Multilayer Substrate Isolated Converter Thermal Design
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Solution Overview
Problem
Conventional isolated converters face challenges in reducing size while maintaining effective heat dissipation due to the need for isolation distances between heat generation and dissipation components, leading to inefficient heat transfer and increased size.
Innovation Solution
The design incorporates a multilayer substrate with conductor patterns and thermal conductive members that overlap magnetic cores, allowing for efficient heat transfer through electric insulating layers, reducing the size of the converter while enhancing heat dissipation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an isolation distance is provided between the coil pattern and heat conduction via, then electrical insulation is ensured, but the size of the converter is increased and heat dissipation efficiency is reduced
Solution Approach 1:
The patent transitions from planar isolation to three-dimensional overlapping configuration. The heat conduction via is positioned to overlap the magnetic core when viewed from the front surface, utilizing the vertical dimension to achieve both electrical insulation and thermal conduction without increasing the converter's footprint.
Solution Approach 2:
The magnetic core serves as an intermediary element that enables both electrical insulation and thermal conduction. By positioning the heat conduction via to overlap the magnetic core, the via is electrically insulated from the coil pattern while maintaining thermal contact with the magnetic core for efficient heat dissipation.
2Reliability
If the distance between the heat generation portion and heat conduction via is increased, then electrical insulation is improved, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent utilizes the vertical dimension to reduce the distance between the heat generation portion (coil pattern) and heat conduction via. By positioning the via to overlap the magnetic core from the front surface, the thermal conduction path is shortened while electrical insulation is maintained through the magnetic core's insulation properties.
3Volume of moving object
If the size of the coil pattern is reduced to provide isolation distance, then isolation distance is achieved, but the amount of heat generation in the coil pattern is increased
Solution Approach 1:
The patent eliminates the need to reduce coil pattern size by utilizing vertical overlap positioning. The heat conduction via is placed to overlap the magnetic core in the vertical dimension, allowing the coil pattern to maintain its optimal size for minimizing heat generation while still achieving adequate electrical isolation through the overlapping configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a compact isolated converter with improved heat dissipation capabilities, suppressing temperature differences between coil patterns and enabling efficient heat transfer without the need for additional heat transfer vias, thus reducing size and enhancing performance.
Implementation Method 1
at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the substrate and the magnetic core
Implementation Method 2
an insulative heat-transferring member electrically insulating the first conductor pattern from the second conductor pattern
Data Source
AI summary
An isolated converter reduced in size compared with a conventional isolated converter and having a high heat dissipation characteristic is provided. The isolated converter includes a multilayer substrate having a first through hole and a magnetic core partially passing through the first through hole. The multilayer substrate includes a first conductor pattern formed at a position overlapping the magnetic core on a second surface when viewed from a direction orthogonal to a first surface, a second conductor pattern formed between the first surface and the second surface at a position overlapping the magnetic core and the first conductor pattern when viewed from the direction orthogonal to the first surface, at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the multilayer substrate and the magnetic core, and an electric insulating layer electrically insulating the first conductor pattern from the second conductor pattern.