Isolated Gate Driver Package Layout for Creepage and Clearance
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Solution Overview
Problem
Existing integrated circuit (IC) packaging techniques face challenges in meeting specified creepage and clearance requirements, especially as package dimensions are reduced, which is crucial for withstanding high voltage levels.
Innovation Solution
A voltage isolated IC package configuration that includes a first package with a transformer and a mold material, and a second package with semiconductor dies and a lead frame, where the packages are mechanically coupled and the lead sets are configured for direct or indirect electrical connection, with features like preformed pillars or shaped leads to enhance electrical and mechanical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package dimensions are reduced to achieve compact size, then productivity and integration are improved, but creepage and clearance requirements cannot be met, compromising voltage isolation reliability
Solution Approach 1:
The package is divided into two separate packages (first package containing transformer primary, second package containing transformer secondary and semiconductor dies) that are mechanically coupled. This segmentation allows each package to be optimized independently for voltage isolation requirements while maintaining compact overall dimensions through the coupling mechanism.
Solution Approach 2:
A mechanical coupling structure serves as an intermediary between the first and second packages, providing both physical connection and electrical isolation. The coupling mechanism includes features like preformed pillars or shaped leads that establish electrical connections while maintaining proper creepage and clearance distances through the coupling structure itself.
2Reliability
If creepage and clearance distances are increased to meet voltage isolation requirements, then voltage isolation reliability is improved, but package dimensions increase, reducing productivity
Solution Approach 1:
By separating the high-voltage primary circuit components into a first package and the low-voltage secondary circuit components into a second package, the design achieves the required creepage and clearance distances without proportionally increasing overall package volume. The mechanical coupling between packages efficiently bridges the isolation gap.
Solution Approach 2:
The mechanical coupling structure utilizes three-dimensional spatial arrangement to achieve electrical isolation through proper spacing and orientation, rather than simply increasing linear dimensions in one direction. This allows meeting voltage isolation requirements while maintaining compact footprint.
3Productivity
If direct electrical connection between lead sets is implemented to improve electrical connectivity, then productivity and integration are improved, but voltage isolation may be compromised if clearance requirements are not met
Solution Approach 1:
The mechanical coupling structure acts as an intermediary that enables direct electrical connection between lead sets while inherently maintaining the required clearance and creepage distances. The coupling mechanism's physical design ensures voltage isolation is preserved even as electrical connectivity is established.
Solution Approach 2:
Different regions of the lead sets and coupling structure have different functional properties: some areas are designed for electrical connection (high conductivity) while other areas maintain isolation (proper spacing and insulation). This local differentiation allows simultaneous achievement of electrical connectivity and voltage isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration effectively addresses the challenge of meeting creepage and clearance requirements, ensuring reliable voltage isolation and electrical connectivity while maintaining compact package dimensions.
Implementation Method 1
Magnetic coupling typically relies on use of a transformer to couple, yet galvanically separate, circuits on the different sides of the transformer
Data Source
AI summary
According to one aspect of the present disclosure, a voltage isolated integrated circuit (IC) package configuration includes a first package comprising a transformer and a mold material enclosing the transformer to form a first package body, wherein the first package comprises a first lead set to permit electrical connection to the transformer. In some embodiments, a second package comprising a lead frame, two or more semiconductor die supported by the lead frame, and a mold material enclosing the two or more semiconductor die to form a second package body, wherein the lead frame comprises a second lead set to permit electrical connection to the two or more semiconductor die. In some embodiments, the one or more leads of the first lead set is directly electrically connected to one or more leads of the second lead set, wherein the first package and the second package are mechanically coupled together.