Isolated Heat Exchanger Flow Paths for Electronic Device Thermal Management

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Solution Overview

Problem

Electronic devices face challenges in efficiently dissipating heat while preventing moisture and dust ingress, particularly in high-power components that generate significant heat and require effective heat exchanger solutions.

Innovation Solution

The electronic device incorporates a heat exchanger with distinct internal and external flow paths, isolated from each other, and a protective cover with openings that communicate with the external flow path, creating a sub-space for enhanced heat dissipation and protection from environmental contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat exchanger is used for heat dissipation, then heat exchange efficiency is improved, but moisture and dust may enter the electronic device

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmoisture and dust ingress
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The heat exchanger is divided into two isolated flow paths: a first flow path for internal heat exchange within the device, and a second flow path for external heat exchange with the environment. This segmentation allows heat dissipation functionality while preventing moisture and dust from entering the internal space through the external flow path.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat exchanger acts as an intermediary component between the internal electronic module and the external environment. It provides a controlled interface for heat transfer while blocking the passage of moisture and dust, mediating between the need for heat dissipation and the need for internal protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the heat exchanger allows external airflow for heat dissipation, then heat exchange efficiency is improved, but the internal space becomes vulnerable to contaminants

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidprotection from contaminants
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The flow paths are segmented into internal and external regions. The first flow path handles internal air circulation for heat exchange, while the second flow path handles external air flow. The isolation between these segments ensures that external contaminants cannot access the internal electronic module space.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The harmful function (contaminant ingress) is extracted from the heat exchanger system by creating separate flow paths. The external flow path takes out the heat dissipation function while leaving the internal space protected, effectively separating the beneficial heat exchange function from the harmful contaminant transmission function.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If a protective cover with openings is used, then heat dissipation is enabled, but moisture and dust can enter through the openings

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidmoisture and dust entry
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The heat exchanger serves as an intermediary between the protective cover openings and the internal electronic module. It accepts external airflow through the openings via the second flow path, performs heat exchange, and then isolates the internal space through the first flow path, preventing direct exposure of internal components to contaminants entering through openings.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat exchange efficiency and reduces the entry of moisture and dust into the device, allowing it to operate effectively in high-temperature environments, including outdoor and automotive applications.

Implementation Method 1

The heat exchanger is disposed between the protective cover and the electronic module

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The heat exchanger has a first flow path and a second flow path... The second flow path and the opening communicate

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12200899B2Electronic device
Publication Date: 2025.01.14 INNOLUX CORP
  • US12200899B2 patent drawing
  • US12200899B2 patent drawing
  • US12200899B2 patent drawing

AI summary

An electronic device is provided. The electronic device includes a protective cover, an electronic module, and a heat exchanger. The protective cover has an opening. The electronic module is disposed below the protective cover. The heat exchanger is disposed between the protective cover and the electronic module. A sub-space is defined between the heat exchanger and the protective cover. The heat exchanger has a first flow path and a second flow path. The first flow path and the sub-space communicate. The second flow path and the opening communicate. The first flow path is isolated from the second flow path.