Thermally Isolated Heat Sink Structure for Multi-Die Cooling
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Solution Overview
Problem
In multi-chip packages, heat transfer between integrated circuit dies with different power usage and temperature ranges is inhibited by thermal cross-talk, leading to inefficient cooling and potential throttling of dies to stay within acceptable temperature ranges.
Innovation Solution
A heat sink is split into thermally isolated sub-heat sinks, with one sub-heat sink mechanically integrated but thermally isolated from another, allowing separate thermal control for each die type, such as graphics processing chips and high-bandwidth memory chips, using pedestals and heat pipes for independent heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single integrated heat spreader is used for multiple dies, then the device complexity is reduced and manufacturing is simplified, but thermal cross-talk occurs between dies with different thermal requirements, degrading cooling efficiency
Solution Approach 1:
The integrated heat spreader is segmented into multiple thermally isolated zones using low thermal conductivity material walls. These walls divide the heat spreader into separate thermal zones, each dedicated to specific dies with identical thermal requirements. This segmentation prevents thermal cross-talk between zones while maintaining the benefits of an integrated heat spreader structure, thereby resolving the contradiction between device complexity and thermal control reliability.
Solution Approach 2:
Different regions of the heat spreader are given different thermal properties through the introduction of thermal isolation walls. The walls create localized thermal environments tailored to specific die requirements. This local quality approach allows each die to operate in its optimal thermal zone without being affected by adjacent dies, resolving the contradiction between simplified integrated structure and differentiated thermal control.
2Reliability
If thermally isolated sub-heat sinks are used for each die type, then independent thermal control is achieved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Multiple sub-heat sinks are mechanically merged into a single integrated assembly that attaches to the segmented heat spreader. The thermal isolation walls are integrated into the heat spreader structure itself, creating a unified component that provides both thermal isolation and mechanical support. This merging approach reduces the number of separate components and simplifies assembly, resolving the contradiction between independent thermal control and device complexity.
3Reliability
If thermally isolated sub-heat sinks are used for each die type, then independent cooling is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The heat spreader is constructed as a composite structure combining high thermal conductivity material for heat dissipation with low thermal conductivity material for thermal isolation. The thermal isolation walls are formed from materials with inherently low thermal conductivity, providing effective thermal barriers without requiring extremely tight manufacturing tolerances. This composite material approach reduces manufacturing precision requirements while maintaining effective thermal isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and independent cooling of dies with different thermal requirements, maintaining optimal temperature ranges without thermal cross-talk, enhancing overall cooling performance.
Implementation Method 1
The second sub-heat sink has one or more heat pipes coupling a second heat sink base and heat sink fins to the IHS above the HBM chips
Data Source
AI summary
Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.