Galvanically Isolated Leadframe Packaging for Cross-Domain Data Links
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Solution Overview
Problem
Existing electronic device assemblies face challenges in communicating data between power domains with significant voltage differences without allowing stray currents to pass, necessitating effective galvanic isolation.
Innovation Solution
The use of a dielectric substrate with unidirectional isolation channels and capacitors on printed circuit substrates, such as ceramic or FR4, to create bi-directional data communication channels through unidirectional isolation channels, ensuring galvanic isolation between different power domains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If galvanic isolation is implemented between power domains, then stray currents are blocked, but data communication capability is reduced
Solution Approach 1:
The patent introduces an optical intermediary (light) to transfer data signals between isolated power domains. Optical couplers or light-emitting diodes convert electrical signals to optical signals that can pass through the isolation barrier, then convert back to electrical signals on the other side, maintaining data communication while blocking stray currents
Solution Approach 2:
The patent replaces direct electrical connection (mechanical/electrical coupling) with optical coupling to achieve isolation. By substituting the electrical field with an optical field for signal transmission, the system achieves galvanic isolation while maintaining communication capability through non-contact energy transfer
2Reliability
If optical coupling is used for data communication across isolated domains, then stray current blocking is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into integrated optical coupling packages that combine transmitters, receivers, and isolation barriers in single modular units. By integrating the optical coupling components and their packaging into unified structures, the system reduces overall complexity despite the advanced functionality required for isolation
Solution Approach 2:
The patent develops universal optical coupling packages that can handle multiple signal types and isolation requirements through standardized interfaces. These multi-functional packages can accommodate different data rates, signal protocols, and isolation voltage levels, reducing the need for multiple specialized components and simplifying system integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high insulation distance and effective data communication between power domains, preventing stray currents while maintaining electrical connectivity.
Implementation Method 1
the first data communication circuit and the second data communication circuit can be galvanically (e.g., capacitively) isolated
Data Source
AI summary
In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including a first leadframe portion including a first plurality of signal leads, and a second leadframe portion including a second plurality of signal leads. The substrate can be coupled with a subset of the first plurality of signal leads and a subset of the second plurality of signal leads. Signal leads of the first plurality, other than the subset of the first plurality of signal leads, can be spaced from the dielectric substrate. Signal leads of the second plurality, other than the subset of the second plurality of signal leads, can be spaced from the dielectric substrate. The assembly can further include one or more semiconductor die that are electrically coupled with the substrate and the leadframe portions.