Isolated LED Structures on Phototransmissive Substrate
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Solution Overview
Problem
The manufacturing process for light-emitting devices with multiple LED chips connected in series is complex and costly due to substrate separating and packaging processes, which increases time and expenses.
Innovation Solution
A light-emitting device design featuring isolated first and second light-emitting structures on a phototransmissive substrate, with an inter-structure conductive layer electrically connecting the semiconductor layers, allowing for efficient series connection without direct contact, thereby simplifying the manufacturing process and improving reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If multiple LED chips are connected in series through substrate separating and packaging processes, then light-emitting efficiency is improved, but manufacturing complexity and time increase
Solution Approach 1:
Multiple LED chips are formed on a single substrate simultaneously through a unified manufacturing process, merging what would traditionally be separate substrate separating and packaging processes into one integrated flow. This reduces manufacturing complexity while maintaining the series connection architecture for improved light-emitting efficiency.
Solution Approach 2:
The conductive layers and electrical connections are pre-formed on the substrate before the LED chips are fully assembled and packaged. This preliminary action simplifies subsequent manufacturing steps by having the electrical interconnection infrastructure ready in advance, reducing overall process time and complexity.
2Loss of energy
If multiple LED chips are connected in series through substrate separating and packaging processes, then light-emitting efficiency is improved, but manufacturing time and costs increase
Solution Approach 1:
Multiple LED chips are formed on a single substrate simultaneously through a unified manufacturing process, merging what would traditionally be separate substrate separating and packaging processes into one integrated flow. This reduces manufacturing complexity while maintaining the series connection architecture for improved light-emitting efficiency.
Solution Approach 2:
The conductive layers and electrical connections are pre-formed on the substrate before the LED chips are fully assembled and packaged. This preliminary action simplifies subsequent manufacturing steps by having the electrical interconnection infrastructure ready in advance, reducing overall process time and complexity.
3Reliability
If light-emitting structures are isolated without direct contact, then reliability is improved, but electrical connection complexity increases
Solution Approach 1:
Conductive layers are introduced as intermediary elements between isolated light-emitting structures to establish electrical connections. These conductive layers act as mediators that enable electrical interconnection without requiring direct physical contact between the light-emitting structures themselves, thereby maintaining reliability while simplifying the connection architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light-emitting efficiency and reduces manufacturing complexity and costs by enabling effective series connection of LEDs without direct contact between structures, improving reliability and efficiency.
Implementation Method 1
a phototransmissive substrate and a first light-emitting structure and a second light-emitting structure on the phototransmissive substrate
Implementation Method 2
an inter-structure conductive layer configured to electrically interconnect the first conductivity-type semiconductor layer of the first light-emitting structure to the second conductivity-type semiconductor layer of the second light-emitting structure
Implementation Method 3
an active layer on the first conductivity-type semiconductor layer
Data Source
AI summary
A light-emitting device may include separate, first and second light-emitting structures that are isolated from direct contact with each other on a phototransmissive substrate. Each light-emitting structure may include a first conductivity-type semiconductor layer, an active layer on the first conductivity-type semiconductor layer, and a second conductivity-type semiconductor layer on the active layer. The first and second light-emitting structures may be electrically connected to each other. An inter-structure conductive layer may electrically interconnect the first conductivity-type semiconductor layer of the first light-emitting structure to the second conductivity-type semiconductor layer of the second light-emitting structure. The second light-emitting structure may include a finger structure extending from an outer edge of the second light-emitting structure toward an interior of the second light-emitting structure. The second light-emitting structure may include island structures that are isolated from direct contact with each other and a bridge structure between adjacent island structures.