Package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding method
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Solution Overview
Problem
Conventional isolation methods in semiconductor devices face limitations such as bulkiness, limited bandwidth, susceptibility to environmental factors, and challenges in maintaining adequate creepage and clearance distances, particularly in leadless packages, which complicate manufacturing and introduce reliability risks.
Innovation Solution
Utilizing a glass substrate with integrated capacitive coupling between semiconductor dies through a third electrically conductive plate, eliminating the need for external components and coatings, and enabling galvanic isolation while allowing data exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional isolation components (optocouplers, capacitors, transformers) are used, then galvanic isolation is achieved, but the device becomes bulky and has limited bandwidth
Solution Approach 1:
The patent merges the isolation function with the semiconductor die structure itself by integrating capacitive coupling layers directly into the package substrate. This eliminates the need for separate external isolation components while maintaining galvanic isolation between different voltage domains, thereby reducing overall device size while preserving the isolation function.
Solution Approach 2:
The isolation mechanism is nested within the package substrate structure. The capacitive coupling layers are embedded between conductive interconnect layers within the substrate, creating a compact nested arrangement where the isolation function is contained within the existing package architecture rather than requiring external components.
2Reliability
If metal layers are used to create insulation barriers within semiconductor structure, then isolation is achieved, but the insulation distance is inherently limited posing risks of electrostatic discharge
Solution Approach 1:
The patent uses a composite structure combining multiple materials with different electrical properties. The package substrate incorporates dielectric materials with high breakdown voltage characteristics combined with conductive layers, creating a multi-layer composite structure that provides both electrical isolation and adequate insulation distance within a compact form factor, reducing ESD risks while maintaining reliable isolation.
3Area of stationary object
If leadless package configuration is used, then footprint is reduced, but manufacturing complexity increases and reliability risks are introduced
Solution Approach 1:
The patent merges the isolation function with the package substrate structure itself, eliminating the need for separate isolation components and reducing the number of manufacturing steps. The capacitive coupling is integrated into the substrate fabrication process, simplifying manufacturing while maintaining compact footprint characteristics of leadless packages.
4Area of stationary object
If leadless package with exposed pad is used, then footprint is reduced, but specialized coatings are needed to protect against environmental factors
Solution Approach 1:
The patent merges the protective function with the existing substrate structure. The package substrate itself provides environmental protection, and the capacitive coupling structure is fully enclosed within the substrate, eliminating the need for additional specialized coatings on exposed pads while maintaining the compact footprint of leadless packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances device reliability, simplifies manufacturing, and improves performance in demanding environments by providing robust isolation and efficient data transfer without relying on additional coatings or exposed pads.
Implementation Method 1
a capacitive coupling is provided between: said first electrically conductive plate and said third electrically conductive plate, and said second electrically conductive plate and said third electrically conductive plate
Data Source
AI summary
The present disclosure generally relates to the field of packaging and, more specifically, to leaded and leadless packages that include at least two galvanic coupled semiconductor dies.