Heat Dissipation Structure With Isolated Power Paths for SiP
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Solution Overview
Problem
In System-in-Package (SiP) technology, long power routing paths through substrates cause significant voltage drops, degrading performance as input voltage decreases, and conventional heat sinks can lead to short-circuits and increased power path resistance.
Innovation Solution
An electronic device with a heat dissipation structure featuring physically separated conductive elements on a passive surface, which receives input power independently and transmits multiple power paths through conductive vias to the electronic component, reducing power path resistance and preventing short-circuits by electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a long power routing path through the substrate is used, then the substrate can provide power routing, but significant voltage drops occur and performance degrades
Solution Approach 1:
The power routing path is segmented into multiple independent conductive elements (first conductive element, second conductive element, third conductive element) instead of using a single long path through the substrate. Each segment provides a separate power delivery route, reducing the cumulative resistance and voltage drop across the entire power delivery path.
Solution Approach 2:
The power routing transitions from a two-dimensional substrate plane to a three-dimensional structure by extending conductive elements vertically through the passive surface. This allows power to be delivered through multiple spatial dimensions, shortening the effective current path and reducing voltage drops.
2Temperature
If conventional heat sinks are used, then heat dissipation is provided, but short-circuits occur and power path resistance increases
Solution Approach 1:
The heat dissipation structure is divided into multiple physically separated conductive elements that are electrically isolated from each other. This segmentation prevents short-circuits between different power paths while maintaining effective heat dissipation through the distributed conductive structure.
Solution Approach 2:
An insulating layer is introduced as an intermediary between the first conductive element and the second conductive element. This insulating layer prevents electrical short-circuits while allowing thermal energy to dissipate through the heat dissipation structure.
3Power
If multiple power paths are provided through the heat dissipation structure, then power delivery efficiency is improved, but the structure becomes more complex
Solution Approach 1:
The heat dissipation structure is designed to serve dual functions: it provides multiple power delivery paths through its conductive elements while simultaneously performing heat dissipation. This multi-functionality reduces the need for separate power routing structures, thereby reducing overall device complexity.
Solution Approach 2:
The power delivery function and heat dissipation function are merged into a single integrated structure. The conductive elements that form the heat dissipation structure also serve as power delivery paths, combining two functions into one structure to reduce complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces power path resistance and prevents short-circuits, enhancing performance by maintaining stable power delivery and reducing package size, while allowing for multiple power paths with different voltages to be transmitted efficiently.
Implementation Method 1
The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface
Implementation Method 2
heat dissipation structure is disposed on the passive surface of the electronic component and configured to provide power to the electronic component
Data Source
AI summary
An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.