Isolation Membrane for Substrate Carrier Contamination Control

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Solution Overview

Problem

Conventional Front Opening Unified Pods (FOUPs) for semiconductor wafers face issues with contamination, chafing, and breakage, leading to inefficient storage and processing due to inadequate isolation and airflow management, which can result in the spread of contaminants and damage to other wafers and machinery.

Innovation Solution

The implementation of an isolator membrane within substrate carriers and storage systems that provides a barrier against contamination and breakage, while also directing airflow in a laminar fashion to maintain cleanliness and prevent contamination, using materials such as plastics or metals that can be easily removable and integrated into high-density or low-density configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If substrates are stored in high-density stacked formation, then space utilization is improved, but contamination spread and breakage risk increase

Engineering Contradiction:
Improvespace utilizationVSAvoidcontamination spread
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces isolation membranes that divide the continuous substrate stack into segmented, isolated compartments. Each substrate or group of substrates is separated by these membranes, preventing contamination from spreading between adjacent substrates while maintaining the high-density stacked configuration. This segmentation allows space-efficient storage without the harmful effects of direct substrate-to-substrate contact.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The isolation membrane acts as an intermediary barrier between substrates in the stacked formation. This intermediate element prevents direct contact between substrates, blocking the transmission of contaminants, moisture, and physical damage while allowing the stack to maintain its compact structure. The membrane mediates between the need for high-density storage and the need to prevent contamination spread.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If substrates are stored in high-density stacked formation, then space utilization is improved, but breakage risk increases

Engineering Contradiction:
Improvespace utilizationVSAvoidbreakage resistance
Core Design Contradiction:
Area of stationary objectVSStrength

Solution Approach 1:

By segmenting the substrate stack with isolation membranes, the patent reduces the transmission of mechanical stresses and impacts between substrates. Each substrate is isolated in its own compartment, preventing breakage from propagating through the stack and reducing the overall breakage risk in high-density configurations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The isolation membranes provide beforehand cushioning by creating protective barriers between substrates before any damage can occur. These membranes absorb and distribute mechanical stresses, preventing direct impact between substrates during handling, transport, or storage, thereby preemptively reducing breakage risk.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Object-affected harmful factors

If airflow is directed through substrate stacks, then contamination control is improved, but flow distribution difficulty increases

Engineering Contradiction:
Improvecontamination controlVSAvoidflow distribution difficulty
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The isolation membranes segment the airflow path into distinct channels between substrates. This segmentation allows for controlled, uniform laminar flow distribution across each substrate surface without the complexity of designing a single complex flow distribution system for the entire stack. Each compartment can be independently optimized for airflow.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The membranes enable local quality control of airflow by allowing different flow characteristics in different regions of the stack. Each substrate compartment can receive optimized laminar flow tailored to its specific requirements, improving contamination control without requiring a uniformly complex flow distribution system throughout the entire stack.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively isolates substrates from each other and from contaminants, reducing the risk of contamination and breakage, and enhances airflow efficiency, resulting in higher quality and efficient substrate manufacturing, processing, and storage by preventing the spread of debris and ensuring clean, laminar airflow.

Implementation Method 1

directing air and gas to each individual substrate in a laminar fashion, wherein the gas or air is direct, laminar and clean

Methodology Applied
Scientific EffectLaminar flow: Laminar Flow

Data Source

PatentUS10818530B1Substrate carriers with isolation membrane
Publication Date: 2020.10.27 MURATA MASCH LTD
  • US10818530B1 patent drawing
  • US10818530B1 patent drawing
  • US10818530B1 patent drawing

AI summary

Carrier, container or other system that provides a separation and protection for substrates, wafers, etc. for before, during or after processing or storage through the use of a membrane integral to the carrier or container respectively. This includes for use with Tec-Cell systems with high and low density configurations as well as other standardized systems, such as FOUPs. Includes protection for contamination brakeage chafing, through isolation and containment. Additional features are included such as the membrane providing guides or otherwise increasing efficiency or presence of airflow, such as laminar airflow over each substrate, wafer, etc. being held.