Isolation Trench Thermal Isolation Semiconductor Photonics

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Solution Overview

Problem

The thermal stress caused by modulator heater structures in semiconductor photonics devices leads to cracking, delamination, and damage in dielectric layers, reducing the reliability and operational life of the devices.

Innovation Solution

Incorporating an isolation trench around the modulator heater structure to thermally isolate it from the dielectric layers, reducing heat absorption and stress, thereby preventing damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a modulator heater structure is used to stabilize resonant wavelengths, then temperature stability is improved, but thermal stress causes cracking and delamination in dielectric layers

Engineering Contradiction:
Improvetemperature stabilityVSAvoidthermal stress damage
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an isolation trench that segments the dielectric layers into isolated regions. This trench physically separates the modulator heater structure from the surrounding dielectric layers, preventing thermal stress propagation while maintaining temperature stability functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The isolation trench acts as an intermediary element between the modulator heater structure and the dielectric layers. It mediates the thermal stress by providing a physical barrier that blocks stress transmission while allowing the heater to maintain its temperature stabilization function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Use of energy by moving object

If the modulator heater structure is positioned close to the optical modulator, then temperature control efficiency is improved, but thermal stress increases the likelihood of dielectric layer damage

Engineering Contradiction:
Improvetemperature control efficiencyVSAvoiddevice reliability
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The isolation trench creates segmented regions that allow close positioning of the modulator heater to the optical modulator for efficient temperature control, while simultaneously protecting the dielectric layers from thermal stress damage through physical separation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The isolation trench serves as a protective intermediary that enables efficient thermal coupling between the modulator heater and optical modulator while preventing harmful thermal stress from reaching the dielectric layers, thus maintaining both efficiency and reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The isolation trench enhances the structural integrity and reliability of the semiconductor photonics device by minimizing thermal stress-induced damage to dielectric layers, allowing for consistent operation and increased device lifespan.

Implementation Method 1

The isolation trench reduces the amount of heat absorbed in the dielectric layer(s) in that the isolation trench thermally isolates the modulator heater structure from the dielectric layer(s)

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20250208445A1Semiconductor photonics device and methods of formation
Publication Date: 2025.06.26 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250208445A1 patent drawing
  • US20250208445A1 patent drawing
  • US20250208445A1 patent drawing

AI summary

A semiconductor photonics device includes an optical modulator structure and a modulator heater structure in one or more dielectric layers of the semiconductor photonics device. An isolation trench is included around the modulator heater structure to reduce the likelihood of damage to the dielectric layer(s) that might otherwise be caused by thermal stress. The isolation trench may include an air gap through the dielectric layer(s), and the air gap surrounds the modulator heater structure in a top-down view of the semiconductor photonics device. The isolation trench reduces the amount of heat absorbed in the dielectric layer(s) in that the isolation trench thermally isolates the modulator heater structure from the dielectric layer(s). This reduces the likelihood of cracking, delamination, and/or another type of damage to the dielectric layer(s) that might otherwise be caused by thermal stress to the dielectric layer(s).