Isolator Integrating Impedance Elements on Substrate
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Solution Overview
Problem
Conventional high-frequency signal isolators with unbalanced input and output ports face issues due to large arrangement gaps and longer connection wiring lines between chip components, leading to increased parasitic components, narrower signal propagation bands, higher passage loss, and higher input impedance.
Innovation Solution
The isolator design incorporates a core isolator with a permanent magnet and soft magnetic material core, along with a circuit-defining section that integrates impedance elements like capacitors and resistors directly on the substrate, reducing the number of components and connection wiring lengths, thereby minimizing parasitic components and enhancing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple chip components are mounted on a main substrate, then the isolator can be assembled with separate impedance elements, but the main substrate becomes larger and connection wiring lines become longer causing increased parasitic components
Solution Approach 1:
The patent merges multiple separate chip components (capacitor, resistor, inductor) and the main substrate into a single integrated circuit board structure. The impedance elements are formed directly on the circuit board as conductor patterns rather than being separate mounted components, eliminating the need for multiple discrete parts and their associated connection wiring.
2Ease of manufacture
If multiple chip components are mounted on a main substrate, then the isolator can be assembled with separate impedance elements, but the frequency band for signal propagation becomes narrower due to larger parasitic inductance
Solution Approach 1:
The patent merges multiple separate chip components (capacitor, resistor, inductor) and the main substrate into a single integrated circuit board structure. The impedance elements are formed directly on the circuit board as conductor patterns rather than being separate mounted components, eliminating the need for multiple discrete parts and their associated connection wiring.
3Ease of manufacture
If multiple chip components are mounted on a main substrate, then the isolator can be assembled with separate impedance elements, but passage loss becomes larger due to larger parasitic resistance
Solution Approach 1:
The patent merges multiple separate chip components (capacitor, resistor, inductor) and the main substrate into a single integrated circuit board structure. The impedance elements are formed directly on the circuit board as conductor patterns rather than being separate mounted components, eliminating the need for multiple discrete parts and their associated connection wiring.
4Ease of manufacture
If multiple chip components are mounted on a main substrate, then the isolator can be assembled with separate impedance elements, but the input impedance becomes higher due to larger parasitic inductance and capacitance
Solution Approach 1:
The patent merges multiple separate chip components (capacitor, resistor, inductor) and the main substrate into a single integrated circuit board structure. The impedance elements are formed directly on the circuit board as conductor patterns rather than being separate mounted components, eliminating the need for multiple discrete parts and their associated connection wiring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the size of the main substrate, minimizes parasitic components, and prevents frequency shifts, resulting in improved isolator characteristics with reduced passage loss and higher accuracy of capacitance values.
Implementation Method 1
a permanent magnet that applies magnetic flux to a portion where the first central conductor and the second central conductor cross each other
Implementation Method 2
a soft magnetic material core that is provided on a surface thereof with the first central conductor and the second central conductor so as to cross each other while being insulated from each other
Data Source
AI summary
An isolator includes a core isolator, a main substrate and a circuit-defining section. The main substrate includes a first wiring portion, a second wiring portion and a third wiring portion and has the core isolator and the circuit-defining section mounted thereon. An input port of the core isolator is connected to the first wiring portion. An output port of the core isolator is connected to the second wiring portion. A ground port of the core isolator is connected to the third wiring portion. In the circuit-defining section, a conductor pattern includes a capacitor that is connected in parallel with the core isolator via the first wiring portion and the second wiring portion, and an impedance element that is connected to at least either of the first wiring portion and the second wiring portion.