Isothiazolinone Leveling Agent for Electroplating
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Solution Overview
Problem
Conventional electroplating compositions face challenges in achieving smooth surface leveling, particularly on features with high aspect ratios, leading to defects like voids and seams during the semiconductor device manufacturing process.
Innovation Solution
An electroplating composition incorporating a specific isothiazolinone compound as a leveling agent, along with a metal ion supply source, electrolyte, and other additives, which facilitates even plating and suppresses metal growth on substrate surfaces, thereby improving surface smoothness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional leveling agents (polyethyleneimine, polyglycine, polyurea, polyacrylamide, polyaminoamide, polyalkanolamine, copolymers of polyvinylpyridine, polyvinylpyrrolidone, vinylimidazole, vinylpyrrolidone) are used, then some surface leveling is achieved, but surface smoothness cannot be sufficiently improved
Solution Approach 1:
The patent changes the chemical structure parameters of the leveling agent by using isothiazolinone compounds with specific R1, R2, and R3 groups instead of conventional polymers. This structural parameter change enables superior surface leveling capability that conventional agents cannot achieve.
Solution Approach 2:
The patent creates a composite electroplating composition by combining the isothiazolinone leveling agent with accelerators, suppressors, and other additives in specific formulations, achieving synergistic effects that improve surface smoothness beyond what single agents can provide.
2Productivity
If accelerators are included in the electroplating composition, then plating speed is improved, but bumps are formed and overplating occurs on high aspect ratio features
Solution Approach 1:
The isothiazolinone leveling agent provides local quality control by differentially affecting plating in different regions. It suppresses overplating in high aspect ratio features while allowing normal plating in other areas, creating locally optimized plating characteristics throughout the substrate.
Solution Approach 2:
The leveling agent acts as a feedback mechanism that continuously regulates metal deposition. It responds to local plating conditions and adjusts the deposition rate accordingly, preventing bump formation and overplating while maintaining overall plating speed through the accelerator.
3Adaptability or versatility
If features with high aspect ratios are electroplated, then interconnection density is increased, but voids and seams form due to inadequate leveling
Solution Approach 1:
The isothiazolinone leveling agent provides localized control for high aspect ratio features, ensuring uniform metal fill throughout the feature depth. This local quality enhancement prevents voids and seams in dense interconnections while maintaining overall plating efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves uniform and defect-free electroplated surfaces, especially on features with 5-50 um gaps and aspect ratios of 1:3-1:10, enhancing the quality and reliability of semiconductor devices.
Implementation Method 1
The features are charged by electroplating a composition
Implementation Method 2
The features are charged by electroplating a composition
Implementation Method 3
a leveling agent comprising a compound of formula (1)
Data Source
AI summary
The present invention relates to a leveling agent and electroplating composition comprising the same. When features are plated using the electroplating composition of the present invention, excellently leveled plated surfaces with minimized defects may be obtained.