Isotropic Silicone Elastomer Shrinkage for Micron Patterning

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Solution Overview

Problem

Current methods for high-resolution, high-aspect-ratio patterning are limited by the constraints of engineering tools, and existing techniques for size-scale reduction or expansion of complex 3D structures are not tunable, reversible, or broadly applicable, especially for silicone-based materials.

Innovation Solution

A silicone-based elastomer system is developed using crosslinked poly(siloxane) mixed with a guest molecule, allowing for isotropic reduction or expansion of dimensions by up to 90% while maintaining structural integrity and resolution, compatible with existing additive manufacture and soft lithographic processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If direct formation methods (e.g., 3D-printing) are used for high-resolution patterning, then manufacturing precision is improved, but device complexity and tool constraints worsen the ease of manufacture

Engineering Contradiction:
Improvepattern resolutionVSAvoidtool constraints
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming structures at a larger scale first, then using isotropic shrinkage to reduce them to the target micron-scale dimensions. This allows patterning to be performed at a more manageable scale where tool constraints are less severe, and the final high-resolution structures are obtained through controlled dimensional reduction rather than direct formation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an additional dimensional control mechanism by utilizing isotropic shrinkage in all three spatial dimensions simultaneously. This allows the pattern dimensions to be scaled down uniformly from a larger initial scale to the final micron-scale, adding a dimensional transformation step that bypasses the limitations of direct single-scale patterning tools.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If existing size-scale reduction techniques are applied, then volume reduction is achieved, but reversibility and tunability are lost

Engineering Contradiction:
Improvestructure sizeVSAvoidreversibility and tunability
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent applies dynamics by creating a material system where the dimensional state can be dynamically switched between expanded and shrunk configurations through reversible guest molecule removal and addition. This allows the structure size to be tuned and adjusted on demand, providing adaptability and reversibility that static reduction methods cannot achieve.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent uses parameter changes by controlling the presence and concentration of guest molecules within the polymer matrix to regulate the dimensional state. By adjusting this chemical parameter (guest molecule content), the physical parameter (structure dimension) can be precisely controlled and reversed, enabling tunable and reversible size-scale modification.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If polystyrene thermal shrinkage is used for microfluidics patterning, then size-scale reduction is achieved, but versatility and reversibility are limited

Engineering Contradiction:
Improvepattern dimensionVSAvoidmaterial applicability
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent applies universality by developing a polymer-based isotropic shrinkage system that can be applied to multiple material types and applications beyond polystyrene, including silicones, hydrogels, and other polymers. The guest molecule inclusion/exclusion mechanism provides a universal platform for achieving reversible dimensional change across different material systems and application domains such as microfluidics, tissue engineering, and soft robotics.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses parameter changes by controlling the guest molecule content to regulate the dimensional state of the material. This chemical parameter control enables reversible and tunable size-scale modification that can be applied across different polymer systems, providing versatility that exceeds the fixed thermal shrinkage behavior of polystyrene.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The silicone-based elastomer system enables precise and reversible control over micron-scale structures, facilitating advanced fabrication of complex 3D structures with tunable properties and broad applicability, suitable for various applications including microfluidics and micro-mechanical devices.

Implementation Method 1

isotropically reducing a dimension of the silicone-based elastomer by removing the guest molecule

Methodology Applied
Scientific EffectGuest molecule removal effect:

Data Source

PatentUS10138330B2Silicone elastomers capable of large isotropic dimensional change
Publication Date: 2018.11.27 LAWRENCE LIVERMORE NAT SECURITY LLC
  • US10138330B2 patent drawing
  • US10138330B2 patent drawing
  • US10138330B2 patent drawing

AI summary

Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can ‘shrink’ micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.