Integrated System Test Module for Hard Disk Drive PCB Via Reduction

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Solution Overview

Problem

The complexity and cost of manufacturing printed circuit boards (PCBs) for hard disk drives increase with the number of chips and interconnects, necessitating a reduction in the number of vias and interconnect layers without compromising reliability or functionality.

Innovation Solution

The implementation of a hard disk drive system with an integrated system test (IST) module that includes a system on chip (SOC), memory, and spindle/voice coil motor driver modules, capable of loopback testing and solder joint testing, using a master IST module to configure and test these components via an external interface, reducing the need for multiple interconnect layers and vias.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of chips and interconnections on the PCB is increased, then the functionality and reliability of the hard disk drive system is improved, but the complexity and manufacturing cost of the PCB increases

Engineering Contradiction:
Improvesystem reliabilityVSAvoidPCB complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple testing functions into a single unified IST module that can test multiple chips and interconnections simultaneously. The master IST module coordinates slave IST modules across different chips, combining what would otherwise require separate testing operations and reducing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The IST module is designed as a universal testing platform that can test various components including memory chips, logic chips, and interconnections through a single integrated interface. The module can adapt to test different chip types and configurations without requiring dedicated testing equipment for each component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If the number of vias and interconnect layers on the PCB is reduced to lower manufacturing cost, then the manufacturing cost is decreased, but the reliability and functionality of the system may be compromised

Engineering Contradiction:
ImprovePCB manufacturing costVSAvoidsystem reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The IST module performs comprehensive testing of interconnections and chips before final assembly and shipping. By detecting potential reliability issues early in the manufacturing process, the system can identify and rectify problems that would otherwise require additional vias or layers for redundancy, thereby maintaining reliability while minimizing PCB complexity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The testing system uses the actual operational signals and data paths of the hard disk drive system itself to perform the testing, rather than requiring external complex testing equipment. The IST module leverages the system's own resources to verify reliability, eliminating the need for overspecified PCB designs.

Inventive Principle:
Principle #25Self-service

3Reliability

If comprehensive testing of all chips and interconnections is performed, then the reliability of the assembled system is improved, but the testing time and complexity increase

Engineering Contradiction:
Improveassembled system reliabilityVSAvoidtesting time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The IST module implements continuous testing operations where slave modules are tested sequentially while the master module coordinates and manages the overall test sequence. The testing process maintains continuous operation without idle periods, and the modular architecture allows parallel testing of different chip groups, reducing total testing time while maintaining comprehensive coverage.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The testing system is divided into a master IST module and multiple slave IST modules, each responsible for specific chips or interconnection groups. This segmentation allows distributed testing operations that can proceed in parallel across different segments of the system, significantly reducing the total time required for comprehensive testing compared to a centralized sequential approach.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7439729B2Integrated systems testing
Publication Date: 2008.10.21 MARVELL ASIA PTE LTD
  • US7439729B2 patent drawing
  • US7439729B2 patent drawing
  • US7439729B2 patent drawing

AI summary

A hard disk drive system comprises N hard disk drive means for performing hard disk drive functions and is connected in a daisy chain, wherein N is greater than one. The system includes integrated system test (IST) means for testing and that is integrated with a first one of the N hard disk drive means and includes pattern generating means for generating test pattern data and pattern monitoring means for receiving a returned test pattern. The pattern generating means generates test pattern data that is routed from the first one of the N hard disk drive means serially through the remaining ones of the N hard disk drive means and back to the first one of the N hard disk drive means. The pattern monitoring means generates test result data based on returned test data returned to the first one of the N hard disk drive means.