IT Rack Cooling Assembly with Multi-Temperature Heat Exchange
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Solution Overview
Problem
Existing switch cabinet arrangements inefficiently cool components with varying cooling requirements due to uniform cooling air temperature, leading to overcooling of components with lower needs and increased energy consumption.
Innovation Solution
Implementing a liquid-liquid heat exchanger in conjunction with an air-liquid heat exchanger to provide multiple cooling temperature levels, using liquids with different boiling points for selective cooling of components with varying power requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform cooling air temperature is used for all components, then all components are cooled, but components with lower cooling requirements are overcooled and energy consumption increases
Solution Approach 1:
The patent divides the cooling system into multiple independent cooling circuits, each with its own temperature control. Instead of using a single uniform cooling air temperature for all components, the system segments cooling into different temperature zones (e.g., first cooling air at a lower temperature and second cooling air at a higher temperature) that can be independently adjusted to match the specific cooling requirements of different component groups, thereby eliminating overcooling and reducing energy consumption.
Solution Approach 2:
The patent applies local quality by providing different cooling air temperatures to different spatial zones or component groups within the enclosure. Each region receives cooling air with a temperature specifically suited to the thermal requirements of the components in that location, rather than applying a uniform cooling temperature throughout the entire enclosure.
2Reliability
If cooling air temperature is adjusted to meet the highest cooling requirements, then all components are cooled, but components with lower requirements are overcooled
Solution Approach 1:
The patent implements dynamic temperature control by adjusting the temperature of cooling air based on the real-time or varying thermal requirements of different components. The system can dynamically modify cooling air temperatures across different circuits or zones, allowing the cooling provision to adapt to changing thermal loads rather than maintaining a static high temperature that causes overcooling.
Solution Approach 2:
The patent changes the temperature parameter of cooling air to match the specific requirements of different components. By varying the temperature parameter across different cooling circuits (e.g., first cooling air at a lower temperature parameter and second cooling air at a higher temperature parameter), the system optimizes energy efficiency while ensuring adequate cooling for all components.
3Use of energy by moving object
If multiple cooling temperature levels are provided, then energy efficiency is improved, but device complexity increases
Solution Approach 1:
The patent segments the cooling system into multiple independent circuits or zones, each capable of operating at different temperature levels. This segmentation allows the system to provide multiple cooling temperature levels (e.g., first and second cooling air at different temperatures) while maintaining independent control over each segment, thereby achieving energy efficiency without requiring complete redesign of the entire cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables energy-efficient cooling by adjusting cooling liquid temperatures to match component needs, reducing energy waste and enhancing cooling efficiency.
Implementation Method 1
a cooling device having an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air
Implementation Method 2
the cooling device has a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected
Implementation Method 3
using liquids with different boiling points for selective cooling of components with varying power requirements
Data Source
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AI summary
The invention relates to an electrical enclosure assembly with at least one IT rack or an electrical enclosure housing (1) and with at least one cooling device (2) which has an air-liquid heat exchanger (3) for cooling components (4) received in the IT rack or the electrical enclosure housing (1) using cooled air, wherein the air-liquid heat exchanger (3) has a first feed line (5) for cooled liquid and a first return line (6) for heated liquid. The invention is characterized in that the cooling device (2) has a liquid-liquid heat exchanger (7), the second feed line (8) of which is connected to the first return line (6) of the air-liquid heat exchanger (3). The invention additionally relates to a corresponding method.