In-Plane Thermal Conductance Layer for IC Chip Heat Dissipation

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Solution Overview

Problem

Current vertical heat dissipation methods for IC chips are insufficient in effectively removing heat generated by the underside of the chip, leading to performance limitations due to the reliance on a single vertical thermal path.

Innovation Solution

Incorporation of an in-plane thermal conductance (ITC) layer between the IC chip carrier and the IC chip, which includes extension tabs connected to the vertical side surface of the cover, allowing for both vertical and horizontal heat transfer within the ITC layer, enhancing heat removal efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single vertical heat dissipation path is used, then the structure is simple, but heat removal capacity is insufficient

Engineering Contradiction:

Improvestructure simplicityVSAvoidheat removal capacity

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The patent introduces an in-plane thermal conductance layer that adds horizontal heat transfer capability to the traditional vertical heat dissipation path. This transforms the heat transfer from a single-dimensional vertical path to a multi-dimensional pathway, allowing heat to spread laterally across the carrier before being dissipated vertically, thereby increasing overall heat removal capacity without significantly complicating the structure

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If traditional vertical heat dissipation method is used, then the design is simple, but heat transfer from chip underside is ineffective

Engineering Contradiction:

Improvedesign simplicityVSAvoidheat transfer effectiveness

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The in-plane thermal conductance layer extends horizontally beneath the IC chip, capturing heat from the chip's underside that would otherwise be trapped. This horizontal extension allows the system to utilize heat transfer in multiple directions, effectively addressing the heat dissipation problem from the chip underside while maintaining design simplicity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If only vertical heat transfer path is used, then the thermal path is direct, but heat distribution across the carrier is poor

Engineering Contradiction:

Improvethermal path directnessVSAvoidheat distribution uniformity

Core Design Contradiction:

Device complexityVSStability of the object's composition

Solution Approach 1:

The in-plane thermal conductance layer creates a horizontal heat distribution network that spreads heat laterally across the carrier before vertical dissipation. This two-stage heat transfer process (horizontal spreading followed by vertical dissipation) improves heat distribution uniformity while maintaining the directness of the final heat removal path

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The in-plane thermal conductance layer acts as an intermediary between the IC chip and the vertical heat dissipation structures. It receives heat from the chip, distributes it horizontally across the carrier, and then facilitates vertical heat transfer to the environment, thereby improving heat distribution uniformity

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach increases heat removal capacity by enabling horizontal heat transfer through the ITC layer, effectively addressing the thermal management limitations of traditional vertical methods and improving IC chip performance.

Implementation Method 1

transferring heat within the ITC layer through the ITC layer basal plane(s)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

transferring heat vertically from the IC chip to an in-plane thermal conductance (ITC) layer of an IC chip carrier below the IC chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

transferring heat vertically from an IC chip to an IC chip cover above the IC chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20200066680A1Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer

Publication Date: 2020.02.27 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

An integrated circuit (IC) chip carrier includes an IC chip electrically connected to an IC chip carrier by a plurality of chip-carrier contacts, a cover thermally connected the IC chip upper surface, and an in-plane thermal conductance (ITC) layer upon the IC chip carrier between the IC chip carrier and the IC chip. The ITC layer includes an extension tab connected to a vertical side surface of the cover. Heat is transferred vertically from the IC chip to the cover. Heat is also transferred vertically from the IC chip to the ITC layer. Heat is also transferred within the ITC layer through the ITC layer basal plane(s). The ITC layer basal plane(s) are positioned horizontally where the ITC layer is between the IC chip and the IC chip carrier. The ITC layer basal planes are positioned vertically where the extension tab contacts the vertical side surface of the cover.