Iterative Conformal Coating Modeling for 3D Qubit Geometry
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Solution Overview
Problem
Existing methods for modeling lithographically manufactured qubit devices with large numbers of geometric structures are time-consuming and require significant human and processor resources, as they involve manual generation of device geometries and simulation of chemical processes.
Innovation Solution
A computing device with a processor configured to generate a three-dimensional device model by receiving three-dimensional substrate elements and two-dimensional lithography elements, applying conformal coatings through iterative layer generation, and outputting the model to a computer-aided engineering application, utilizing graphical processing units for efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual generation of device geometries and simulation of chemical processes is used, then modeling accuracy is maintained, but computational time and processor resources increase significantly
Solution Approach 1:
The conformal coating process is segmented into multiple iterations, where each iteration adds a thin layer to the substrate. This segmentation allows the complex coating process to be broken down into manageable computational steps, reducing the overall computational burden while maintaining accuracy through progressive refinement.
Solution Approach 2:
The patent pre-calculates and stores geometric data of substrate elements and lithography elements before performing the conformal coating simulation. This preliminary preparation of geometric information reduces the computational workload during the actual coating simulation, enabling faster processing while maintaining modeling accuracy.
2Adaptability or versatility
If manual generation of device geometries is used, then design flexibility is maintained, but productivity decreases due to significant human resources required
Solution Approach 1:
The patent uses digital copies of substrate elements and lithography elements stored in data structures, allowing rapid replication and modification of device geometries. This digital copying approach maintains design flexibility while dramatically increasing productivity by eliminating manual geometric generation for each design iteration.
Solution Approach 2:
The system allows easy modification of geometric parameters such as layer thickness, substrate dimensions, and lithography patterns by simply changing input parameters rather than manually regenerating geometries. This parameter-based approach maintains full design flexibility while enabling rapid exploration of different device configurations.
3Manufacturing precision
If iterative conformal coating generation is used, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The conformal coating process is divided into multiple iterations, each adding a thin layer with controlled thickness. This segmentation enables precise control of the final coating thickness by accumulating multiple thin layers, achieving high manufacturing precision while managing process complexity through systematic breakdown of the coating process.
Solution Approach 2:
The iterative conformal coating process incorporates feedback mechanisms where each iteration builds upon the previous layer, with the coating thickness and morphology of each layer influencing subsequent layers. This feedback-based iterative approach achieves precise thickness control while the systematic nature of the iterations helps manage process complexity.
Data Source
AI summary
A computing device is provided, including a processor. The processor may generate a three-dimensional device model at least by receiving one or more three-dimensional substrate elements and one or more two-dimensional lithography elements. Generating the three-dimensional device model may further include generating a conformal coating on the one or more three-dimensional substrate elements over a plurality of conformal coating iterations that have respective iteration layer thicknesses. Each conformal coating iteration may include, for each two-dimensional lithography element, generating an iteration layer overlaid on the one or more three-dimensional substrate elements and having an iteration layer shape of at least a portion of that two-dimensional lithography element. Each conformal coating iteration may further include adding the iteration layer to the conformal coating. The processor may output the three-dimensional device model including the one or more three-dimensional substrate elements and the conformal coating.