Integrated Voltage Regulator Package RC Path for Overshoot Control

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Solution Overview

Problem

Voltage regulators in integrated circuits experience transient overshoot, which can lead to reliability issues and damage to powered devices due to high resistance and parasitic inductance in connection lines.

Innovation Solution

Embedding a Resistor-Capacitor (RC) component in the path between the Integrated Voltage Regulator (IVR) and powered devices within the package substrate, reducing connection line resistance and parasitic inductance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If voltage regulators are formed as discrete dies bonded to a printed circuit board, then the voltage regulators can provide power supply voltage regulation, but high resistance and parasitic inductance in connection lines cause transient overshoot

Engineering Contradiction:

Improvetransient overshootVSAvoidparasitic inductance

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent merges the voltage regulator with the package substrate to form an integrated voltage regulator (IVR) structure. The IVR die is mounted on the package substrate and electrically connected through redistribution structures, eliminating discrete connection lines. This integration reduces parasitic inductance and resistance, thereby reducing transient overshoot and improving reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces redistribution structures (conductive traces and vias) as intermediaries between the IVR die and the powered devices. These redistribution structures provide low-inductance electrical connections, replacing traditional high-inductance wire bonds or PCB traces, thus reducing transient overshoot.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If connection lines are used to connect voltage regulators to powered devices, then electrical connection is established, but high resistance and parasitic inductance damage powered devices

Engineering Contradiction:

Improvedamage to powered devicesVSAvoidconnection line resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The voltage regulator is integrated with the package substrate through direct mounting and electrical connection, eliminating separate connection lines. The IVR die is electrically connected to powered devices through low-resistance redistribution structures on the substrate, reducing connection resistance and preventing device damage.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If RC component is embedded in the path between IVR and powered devices, then transient overshoot is reduced, but device complexity increases

Engineering Contradiction:

Improvetransient overshootVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The RC component is embedded directly into the package substrate and integrated with the IVR and powered devices. The resistor and capacitor are formed as part of the substrate structure, creating a unified package that reduces transient overshoot without requiring separate external components or complex assembly processes.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20250372546A1Heterogeneous integration structures to solve IVR overshoot problem

Publication Date: 2025.12.04 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes placing an integrated voltage regulator in a first package component, placing a RC component in a second package component, electrically connecting the RC component to the integrated voltage regulator, and electrically connecting a device die to the RC component. The RC component is in an electrical path that connects the integrated voltage regulator to the device die.