IVR Package Structure With RC Path for Overshoot Suppression

The patent introduces an intermediary structure (redistribution layer with via) between the IVR and powered devices. This intermediary allows the connection to be made through a more direct path with lower parasitic inductance, while still providing routing flexibility through the redistribution layer design. The via acts as a mediator that reduces the harmful inductance compared to traditional long bond wire connections.

The patent transitions from planar connection routing to three-dimensional vertical routing by using via structures that go through the substrate. This dimensional change allows for shorter current paths and reduced parasitic inductance while maintaining the ability to route power to different locations on the package.

The patent merges the voltage regulator die with the package substrate to create an integrated voltage regulator (IVR) structure. By combining these previously separate components into a single integrated unit, the connection resistance and parasitic inductance are dramatically reduced while maintaining manufacturing simplicity through established packaging processes.

The package substrate serves multiple functions: it acts as both the mechanical support structure and the electrical interconnection medium through its redistribution layers and via structures. This multi-functionality eliminates the need for separate connection elements, reducing parasitic inductance while maintaining ease of manufacture.