JEDEC Tray Frame With Swappable Tape Inserts for Mixed Chip Sizes
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Solution Overview
Problem
Existing trays for handling microelectronic assemblies, such as computer chips, face challenges in efficiently accommodating different sizes and shapes while meeting JEDEC standards for stacking and handling, leading to inefficiencies in storage and transportation.
Innovation Solution
A tray design featuring channels with pins and clips to secure thermoformed tapes, allowing for various microelectronic assembly sizes and shapes to be accommodated by changing the tapes, and a frame that supports multiple insert panels with different pocket configurations, ensuring compatibility with JEDEC standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a standardized tray design is used to meet JEDEC standards, then compatibility and stacking ability are improved, but adaptability to different chip sizes and shapes deteriorates
Solution Approach 1:
The tray is divided into modular components: a standardized frame structure that meets JEDEC stacking requirements, and interchangeable insert panels with different pocket configurations. This segmentation allows the overall tray to maintain standard compatibility while the insert panels provide adaptability to different chip sizes and shapes.
Solution Approach 2:
The standardized frame structure serves multiple functions: providing structural support, enabling stacking compatibility with other JEDEC-standard trays, and accommodating different insert panels. This universal base structure allows the same tray framework to handle various chip types by simply changing the insert panel.
2Adaptability or versatility
If custom tray designs are used to accommodate different chip sizes and shapes, then adaptability is improved, but compatibility with JEDEC stacking standards deteriorates
Solution Approach 1:
By separating the tray into a standardized frame portion and customizable insert panels, the design allows custom pocket configurations for different chips while maintaining the standard outer dimensions and stacking interface of the frame, thus preserving JEDEC compatibility.
Solution Approach 2:
The insert panels provide localized customization with different pocket sizes, shapes, and arrangements tailored to specific chip types, while the surrounding frame structure maintains uniform standardized dimensions that ensure compatibility with JEDEC stacking requirements.
3Adaptability or versatility
If multiple specialized trays are used for different chip types, then adaptability to various chip configurations is improved, but device complexity and handling efficiency deteriorate
Solution Approach 1:
A single standardized tray frame serves as a universal container that can accommodate multiple types of insert panels for different chip configurations. This eliminates the need for multiple specialized tray designs, reducing complexity while maintaining adaptability.
Solution Approach 2:
The tray system becomes dynamic through the ability to swap insert panels based on the specific chip type being handled. Rather than using static specialized trays for each chip type, the system adapts by inserting the appropriate panel into the standardized frame, simplifying inventory and handling.
Data Source
AI summary
The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.