Jet Impingement Cooling for Power Electronics Heat Removal
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Solution Overview
Problem
Existing heat exchangers for power electronics devices are inefficient in maintaining optimal operating temperatures across various load conditions, leading to degraded efficiency and reliability in refrigeration systems.
Innovation Solution
A cooling system incorporating a heat removal device with a jet impingement feature and a heat exchanger configuration that includes an inlet and outlet header with heat exchange tubes, where a primary cooling fluid is used to cool a secondary fluid, which is then directed over heat-generating electronic devices via jet impingement to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat exchangers are used for power electronics devices, then the devices can be cooled, but the heat transfer efficiency is insufficient to maintain optimal temperatures under various load conditions
Solution Approach 1:
The heat exchanger is divided into multiple sections with different heat transfer mechanisms. The jet impingement section directly targets high-heat-generation areas with focused cooling jets, while other sections use conventional heat exchange. This segmentation allows optimized cooling for each thermal zone, maintaining optimal temperatures more effectively.
Solution Approach 2:
Different cooling strategies are applied to different locations on the power electronics device. Jet impingement cooling is directed at specific high-heat-generation components, while other areas receive different cooling intensities. This local quality approach ensures optimal temperature control where it is most needed, improving overall reliability.
2Temperature
If cooling intensity is increased to maintain optimal temperatures, then temperature control improves, but system complexity and energy consumption increase
Solution Approach 1:
The jet impingement cooling system is integrated with the conventional heat exchanger into a single unified device. The jet impingement features are incorporated as part of the heat exchanger structure itself, merging two cooling approaches into one system. This reduces overall system complexity while maintaining precise temperature control through the combination of cooling mechanisms.
3Productivity
If jet impingement cooling is applied directly to heat-generating surfaces, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The heat exchanger is designed with universal jet impingement features that can be applied to various power electronics configurations. The jet impingement structure serves multiple functions: it provides direct cooling, enhances convective heat transfer, and can be integrated with different heat exchanger types. This multi-functionality maintains high heat transfer efficiency while simplifying the manufacturing process through standardized design elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively maintains optimal temperatures for power electronics devices, improving the efficiency and reliability of refrigeration systems by enhancing heat transfer and reducing thermal degradation.
Implementation Method 1
The at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface that is thermally coupled to the at least one heat-generating electronic device
Implementation Method 2
The at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface
Implementation Method 3
a primary cooling fluid is used to cool a secondary fluid
Implementation Method 4
The primary cooling fluid and a secondary cooling fluid are arranged in a heat transfer relationship within the at least one heat exchanger
Data Source
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AI summary
A cooling system (60) for cooling at least one heat-generating electronic device (62) includes a heat removal device (74) having a surface (114) that is thermally couplable to the at least one heat-generating electronic device (62). The heat removal device (74) includes an inlet area (102) and at least one jet impingement feature (110) fluidly coupled to the inlet area (102). The at least one jet impingement feature (110) is positioned to direct a primary cooling fluid (C1) toward the surface (114) that is thermally coupled to the at least one heat-generating electronic device (62).