Power Electronics Module With Integrated Jet Cooling Substrate
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Solution Overview
Problem
Conventional heat sinks are inadequate in effectively lowering the operating temperature of power electronics due to increased heat flux generated by advanced electrical systems, necessitating alternative jet impingement heat exchangers and cooling methods.
Innovation Solution
A power electronics module featuring an electrically-conductive substrate with a base portion and posts that define orifices and jet paths, allowing cooling fluid to impinge directly on the power electronics device, while also serving as a collector electrode to enhance thermal energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat sinks are used to cool power electronics, then the structure is simple and easy to manufacture, but the heat dissipation efficiency is insufficient to handle increased heat flux
Solution Approach 1:
The cooling system is segmented into multiple functional zones: an electrically-conductive substrate with integrated orifices for jet cooling, posts for electrical connection, and a power electronics device. This segmentation allows each component to perform its specific function optimally while maintaining manufacturing feasibility.
Solution Approach 2:
The patent merges the cooling function and electrical connection function into a single integrated structure. The electrically-conductive substrate with orifices is combined with posts that provide both structural support and electrical connectivity, eliminating the need for separate cooling plates and electrical connectors.
2Loss of energy
If cooling fluid is directed through orifices to impinge on the power electronics device, then thermal energy transfer is enhanced, but the device complexity increases due to integrated jet cooling structures
Solution Approach 1:
The electrically-conductive substrate serves multiple functions simultaneously: it provides the structural base for mounting the power electronics device, contains integrated orifices for cooling fluid delivery, and works with posts to provide electrical connectivity. This multi-functionality reduces the number of separate components needed.
Solution Approach 2:
The cooling system is designed to be self-contained within the module structure. The orifices are integrated directly into the electrically-conductive substrate, allowing cooling fluid to be delivered directly to the power electronics device without requiring external cooling plates or additional mounting hardware.
3Reliability
If posts are positioned between orifices to provide electrical connection, then electrical conductivity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The posts are strategically positioned in specific locations between the orifices to optimize both electrical connectivity and cooling performance. This localized positioning ensures that electrical connections are made at optimal points while maintaining the effectiveness of the jet cooling paths through the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables more efficient heat dissipation by positioning the cooling fluid closer to the power electronics device, reducing the need for intervening components and improving thermal energy transfer, thus effectively managing the increased heat flux.
Implementation Method 1
Cooling fluid may be used to receive heat generated by the heat-generating device by convective and/or conductive thermal transfer
Implementation Method 2
Cooling fluid may be used to receive heat generated by the heat-generating device by convective and/or conductive thermal transfer
Implementation Method 3
a jet of cooling fluid may be directed such that it impinges a surface of the heat-generating device
Data Source
AI summary
A power electronics module includes an electrically-conductive substrate including a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, and a plurality of posts extending outward from the base portion, where individual posts of the plurality of posts are positioned between individual orifices of the plurality of orifices, and a power electronics device coupled to the plurality of posts opposite the base portion, the power electronics device defining a bottom surface that is oriented transverse to the plurality of jet paths.