Jet Impingement Foam Cooling for High-Heat-Flux Electronics

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Solution Overview

Problem

The increasing heat flux and temperature in electronic components due to miniaturization and higher processing speeds lead to performance degradation, reliability issues, and potential failure, necessitating advanced cooling systems that maintain temperature uniformity and prevent hotspots.

Innovation Solution

Development of high efficiency thermal management devices incorporating jet impingement technology, high conductive metal foam, rib structured surfaces, and a conductive heat spreader plate, with geometrical parameters optimized for effective cooling, including partially or fully foam-filled channels and rib configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional cooling methods (fans, heat sinks, cold plates) are used, then the device structure is simple, but the cooling efficiency is insufficient for high heat flux values

Engineering Contradiction:
Improvecooling efficiencyVSAvoiddevice structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The cooling device is segmented into multiple functional zones: jet impingement regions with multiple nozzles, porous media filling the channel, and rib-roughened surfaces. This segmentation allows each component to perform its specific cooling function optimally, achieving high cooling efficiency for high heat flux applications while maintaining a manageable structural complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Porous media is introduced to fill the channel space, providing extensive surface area for heat transfer between the coolant and the heated surface. This porous structure significantly enhances cooling efficiency by increasing the contact area between the cooling fluid and the high heat flux surface, while the material itself is engineered to balance porosity with structural integrity

Inventive Principle:
Principle #31Porous materials

Solution Approach 3:

The cooling device employs composite structures combining jet impingement nozzles, porous media, and rib-roughened surfaces within a unified channel design. This composite approach integrates multiple heat transfer mechanisms (impingement cooling, porous media convection, and surface roughness enhancement) to achieve superior cooling performance for high heat flux electronic components

Inventive Principle:
Principle #40Composite materials

2Productivity

If jet impingement is used to increase cooling efficiency, then heat transfer rate improves, but pressure drop increases

Engineering Contradiction:
Improveheat transfer rateVSAvoidpressure drop
Core Design Contradiction:
ProductivityVSStress or pressure

Solution Approach 1:

Jet impingement is applied locally at specific regions where high heat flux occurs, rather than uniformly across the entire surface. The porous media is strategically positioned in channels where it can maximize heat transfer while minimizing flow resistance. This localized application of intense cooling measures achieves high heat transfer rates at the critical hot spots without subjecting the entire system to high pressure drops

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The porous media acts as a flow distributor and heat transfer enhancer that reduces the pressure drop associated with jet impingement. By providing a distributed network of flow paths, the porous structure allows the coolant to penetrate and cool the surface uniformly without requiring excessively high jet velocities, thereby reducing the overall pressure drop while maintaining high heat transfer rates

Inventive Principle:
Principle #31Porous materials

3Temperature

If high heat flux is managed, then temperature uniformity improves, but device complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidchannel geometry
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The channel geometry is designed with local variations including rib-roughened surfaces and strategically positioned nozzles that create localized high heat transfer coefficients. These local modifications are concentrated in regions where temperature uniformity is most critical, allowing the device to achieve improved temperature distribution without requiring complex geometry throughout the entire structure

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Rib-roughened surfaces are introduced to add geometric complexity in the transverse dimension, creating multiple flow paths and enhancing mixing between adjacent jet streams. This dimensional addition promotes temperature uniformity by preventing hot spots in the regions between jets, while the ribs themselves can be simple geometric features that do not significantly increase manufacturing complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat transfer and temperature uniformity, reducing stress failure and fatigue by improving local thermal treatment of hotspots, with fully foam-filled channels providing superior cooling efficiency and rib structures further enhancing local Nusselt numbers.

Implementation Method 1

at least one jet impingement of at least one thermal management liquid or gas, wherein the at least one jet inlet channel directs the at least one jet impingement of a liquid or a gas onto a surface of the at least one porous component or at least one foam component

Methodology Applied
Scientific EffectJet impingement: Jet

Implementation Method 2

The coolant is injected to a target plate subject to a high heat flux or high temperature, resulting in a stagnation zone with low temperature and velocity and high rate of heat transfer

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

The at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area

Methodology Applied
Scientific EffectPorosity: Porosity

Implementation Method 5

at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12538447B2High efficiency thermal management devices for use with electronic components having high heat flux values
Publication Date: 2026.01.27 TRUSTEES OF THE CALIFORNIA STATE UNIV
  • US12538447B2 patent drawing
  • US12538447B2 patent drawing
  • US12538447B2 patent drawing

AI summary

High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.