Jet Impingement Coolers for Power Electronics Heat Flux
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing high heat flux generated by power electronics devices, leading to inadequate heat rejection and potential high temperature operation.
Innovation Solution
A jet impingement assembly with a manifold and heat distribution member, featuring orifices, flow conditioning members, and flowpath constriction members, which directs fluid jets onto a heat distribution member with fins to enhance convective heat transfer and manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional heat sinks are used, then the device structure is simple, but the heat rejection capability is insufficient for high heat flux
Solution Approach 1:
The heat sink is segmented into multiple independent jet impingement modules, each with its own manifold and orifice array. This segmentation allows each module to handle localized high heat flux regions independently, improving overall heat rejection capability while maintaining modular simplicity in the overall structure.
Solution Approach 2:
The jet impingement coolers apply localized high-velocity fluid jets to specific high heat flux regions through precisely positioned orifices. This local quality approach concentrates cooling power where it is most needed, significantly improving heat rejection capability in critical areas without requiring the entire heat sink structure to be complex.
2Power
If jet impingement cooling is implemented, then heat transfer efficiency is improved, but fluid stagnation may occur
Solution Approach 1:
The manifold design incorporates preliminary flow distribution features that prevent stagnation before it occurs. By strategically positioning orifices and designing the manifold geometry, the system proactively ensures continuous fluid circulation through all cooling zones, preventing dead zones where stagnation could reduce reliability.
Solution Approach 2:
The system employs dynamic flow distribution through the manifold design, where fluid flow automatically adjusts to maintain continuous circulation. The manifold geometry and orifice arrangement create dynamic flow patterns that adapt to heat load variations, ensuring that fluid continuously moves through all regions and preventing stagnation while maintaining high heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages high heat flux by ensuring efficient heat transfer from power electronics devices, maintaining desired operating temperatures and extending the life of electronics devices through continuous cooling.
Implementation Method 1
fluid may be directed in a jet in a localized region at a high velocity such that the fluid impinges a surface of the heat generating device
Implementation Method 2
heat management device, and may receive heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 3
heat management device, and may receive heat from the heat management device, primarily through convective and/or conductive heat transfer
Data Source
AI summary
Jet impingement assemblies and power electronics devices incorporating jet impingement assemblies are described. The jet impingement assemblies include a fluid inlet, a fluid outlet, a manifold, and a heat distribution member. The manifold includes a distribution side in fluid communication with the fluid inlet, a collection side in fluid communication with the fluid outlet, a plurality of orifices extending from the distribution side to the collection side, and a return channel extending from the collection side to the distribution side. The heat distribution member is positioned proximate to the collection side of the manifold.