Two-Sided Jet Impingement Cooling for Power Electronics
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing high heat flux generated by power electronics devices, leading to inefficient heat removal and potential overheating, especially with the accumulation of low-density vapor in two-phase cooling systems.
Innovation Solution
A two-sided, horizontally stacked jet impingement assembly with manifold plates, heat transfer plates, and orifices that direct coolant jets to impingement surfaces, allowing efficient vapor removal and enhanced heat transfer through the use of fins and a variable slotted channel for vapor guidance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat sinks are used, then device simplicity is maintained, but heat removal efficiency is insufficient for high heat flux
Solution Approach 1:
The cooling system is divided into multiple impingement chambers arranged in series, with each chamber containing jet impingement components (nozzles, manifolds) and heat transfer plates with fins. This segmentation allows distributed heat removal across multiple stages, enabling efficient handling of high heat flux while maintaining a modular structure that balances complexity with performance
Solution Approach 2:
The system transitions from conventional single-phase cooling to two-phase cooling, utilizing the phase change dimension (liquid to vapor) to dramatically enhance heat transfer efficiency. The impingement chambers are designed to facilitate vapor generation and removal, adding a thermal phase dimension to the cooling process that significantly improves heat removal capability
2Productivity
If two-phase cooling is used, then heat transfer efficiency is improved, but vapor accumulation occurs in uppermost regions
Solution Approach 1:
Vapor extraction channels are integrated into the heat transfer plates and impingement chamber structures, providing dedicated pathways that actively remove vapor from the uppermost regions of each chamber. This extraction mechanism prevents vapor accumulation by continuously channeling vapor toward condensation or discharge zones, resolving the harmful effect while preserving the high efficiency of two-phase cooling
Solution Approach 2:
The heat transfer plates with fins serve as intermediaries between the jet impingement zones and vapor removal channels. These plates facilitate the phase change process while simultaneously providing structured pathways for vapor transport, mediating between the heat transfer function and vapor management function to prevent accumulation
3Power
If power electronics devices operate at increased power levels, then processing capability is improved, but operating temperature increases
Solution Approach 1:
The system utilizes parameter changes in the coolant (phase change from liquid to vapor) to dramatically increase heat transfer coefficients. By controlling pressure, temperature, and flow rate parameters within the impingement chambers, the system adapts to varying power levels while maintaining operating temperatures within acceptable ranges, enabling high power operation without proportional temperature increases
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the operating life of power electronics devices by efficiently removing heat and vapor, ensuring effective cooling and maintaining desired operating temperatures.
Implementation Method 1
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 2
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 3
In one example, fluid may be directed in a jet in a localized region at a high velocity such that the fluid impinges a surface of the heat management device coupled to the heat generating device
Implementation Method 4
Jet impingement may also be combined with two-phase cooling, where the heat generating device is cooled by the phase change of the coolant fluid from a liquid to a vapor
Data Source
AI summary
Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.