Jet Solder Bath Bridge Structure for Stable Lead-Free Solder Flow

A bridge member is introduced as an intermediary structure between the primary and secondary jet nozzles. This bridge member includes a guide portion that directs the molten solder flow from the primary nozzle toward the secondary nozzle, and side members that form a channel to contain the solder. The intermediary bridge member enables the solder to travel a longer distance without solidifying or forming oxides, as the guided path prevents exposure to air and maintains flow momentum.

The invention changes the physical parameters of the solder flow path by introducing a guided channel structure. The bridge member creates a controlled environment that maintains solder temperature and prevents oxidation by altering the flow path geometry. The side members form enclosed channels that protect the solder from atmospheric exposure during transit between nozzles.

The invention implements a continuous soldering action by introducing a secondary jet nozzle that follows the primary nozzle. The primary nozzle creates roughly waved solder that fills corners and through-holes, while the secondary nozzle immediately follows to calm the waves and melt any形成的 solder bridges or pointed solder pieces. This continuous two-stage process ensures that the beneficial corner filling is maintained while the harmful solder defects are eliminated in real-time.

The invention converts the harmful effect of roughly waved solder (which creates solder bridges and pointed solder pieces) into a beneficial process. The primary nozzle's rough waves are intentionally used to fill difficult-to-reach areas, and the secondary nozzle then calms these waves to eliminate defects. The harmful rough waves become a useful first step in a two-stage process that ultimately produces high-quality solder joints.