Jetting Polymer Encapsulation for Electronic Component Protection
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Solution Overview
Problem
Existing methods for protecting components in electronic devices, such as hearing devices, from environmental factors and electromagnetic interference are unreliable and difficult to control, particularly in covering top corners and preventing conductive material from contacting terminals.
Innovation Solution
A method involving dispensing and jetting a polymer around and under components on a substrate using a nozzle, followed by controlled curing with a light source to create a reliable and efficient encapsulation, which also allows for shielding against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional protection methods are used, then components are protected from environmental factors, but reliability and controllability deteriorate due to difficulty in covering top corners and preventing conductive material contact
Solution Approach 1:
The encapsulation process is divided into multiple sequential layers, with each layer addressing specific protection needs. The first layer covers bottom surfaces and sides, the second layer addresses top corners, and subsequent layers provide final sealing. This segmentation allows each layer to be optimized for its specific function, improving overall reliability and precision.
Solution Approach 2:
The invention transitions from planar encapsulation to three-dimensional encapsulation by dispensing polymer material that flows and cures in multiple dimensions. The polymer is dispensed to cover not only the top surface but also flows down to cover sides and bottom surfaces, creating a comprehensive 3D protective barrier that traditional planar methods cannot achieve.
2Reliability
If polymer is dispensed to cover all areas including top corners, then protection is improved, but material usage increases and control becomes difficult
Solution Approach 1:
Each dispensing layer applies polymer material slightly beyond the immediate required area to ensure complete coverage of target regions including top corners. The polymer is dispensed with controlled excess that flows to cover adjacent areas, then subsequent layers are applied to seal and contain the material, preventing waste while ensuring complete coverage.
Solution Approach 2:
The first dispensing layer is applied in advance to cover bottom surfaces and sides before the component is fully assembled or before subsequent layers are applied. This preliminary action ensures that when the component is later exposed to conductive materials or environmental factors, the protective barrier is already in place, preventing material waste during rework.
3Manufacturing precision
If multiple layers are dispensed sequentially, then encapsulation quality is improved, but processing time increases
Solution Approach 1:
The dispensing process is designed as a continuous operation where the nozzle moves continuously across the component surface, dispensing polymer material in a seamless flow. The system maintains continuous motion without stopping between layers or areas, and the polymer cures continuously under UV light exposure, eliminating idle time and maintaining production rhythm.
Solution Approach 2:
The dispensing process uses periodic dispensing patterns where the nozzle dispenses polymer in controlled intervals or pulses as it moves across the component. This periodic action allows the polymer to be deposited in manageable amounts that cure properly while maintaining continuous forward motion, preventing pooling or overflow that would require stopping and correcting.
4Manufacturing precision
If jetting method is used for dispensing, then control and precision are improved, but device complexity increases
Solution Approach 1:
The invention replaces traditional mechanical dispensing systems with a jetting-based dispensing system that uses fluid dynamics and UV curing to achieve precise material placement. The jetting nozzle uses controlled polymer flow and UV light activation to deposit material only where needed, eliminating the need for complex mechanical positioning mechanisms and reducing overall system complexity while improving precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides comprehensive protection against environmental factors and electromagnetic interference, ensuring reliable and controlled encapsulation of components with reduced material usage and improved reliability, while preventing conductive material from contacting sensitive terminals.
Implementation Method 1
dispensing at least one first drop of a polymer on and/or around the component by jetting, using a nozzle
Implementation Method 2
at least partly curing the dispensed polymer by exposing the dispensed polymer to a light source
Data Source
AI summary
Disclosed is a method of at least partly encapsulating at least one component arranged on a substrate. The method comprises the step of dispensing at least one drop of a polymer on and/or around the component by jetting, using a nozzle, to obtain a dispensed polymer. The method further comprises at least partly curing the dispensed polymer by exposing the dispensed polymer to a light source to obtain a cured polymer. The method further comprises protecting the nozzle while at least partly curing the dispensed polymer, and repeating the steps of dispensing, at least partly curing and protecting, thereby at least partly encapsulating the component.