Jigless Soldering via Temporary Fixing Agent and Vacuum Vaporization
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Solution Overview
Problem
The existing soldering methods require the use of a jig, which is time-consuming to attach and detach, absorbs heat, and necessitates preparation for each shape of soldering target, leading to inefficiencies and potential misalignment.
Innovation Solution
A method that uses a temporary fixing agent to secure the solder, followed by vaporization in a vacuum or heating to create gaps, reduction with a reducing gas, melting in a vacuum, vacuum breaking to eliminate voids, and cooling to solidify the solder, all without the need for a jig.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a jig is used to fix soldering targets and solder, then positioning precision is improved, but operator burden and time consumption increase
Solution Approach 1:
The soldering target itself serves as the positioning reference by providing positioning protrusions that directly engage with the solder positioning holes. This self-positioning mechanism eliminates the need for external jigs, reducing operator burden while maintaining positioning precision.
2Manufacturing precision
If a jig is used to fix soldering targets and solder, then positioning precision is improved, but time consumption increases
Solution Approach 1:
The self-positioning mechanism using positioning protrusions and holes eliminates the time-consuming steps of attaching and detaching jigs. The soldering target automatically positions the solder through its own structural features, significantly reducing cycle time while maintaining alignment precision.
3Manufacturing precision
If a jig is used for soldering, then positioning is maintained, but heat absorption occurs
Solution Approach 1:
The jig is completely removed from the soldering system. Instead of using an external positioning device, the soldering target's own positioning protrusions provide the necessary alignment, eliminating the heat absorption issue while maintaining positioning stability.
4Ease of operation
If positioning protrusions and holes are provided, then jigless positioning is achieved, but device complexity increases
Solution Approach 1:
The soldering target is designed with positioning protrusions that serve dual purposes: they provide positioning for the solder and are integral to the target's structure. This multi-functional design achieves jigless operation without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces operator burden, eliminates the need for washing, and enhances production efficiency by eliminating jig-related inefficiencies and heat absorption, while preventing oxidation and corrosion.
Implementation Method 1
a vaporization step of placing the soldering target with the solder temporarily fixed thereto in a vacuum or heating the soldering target with the solder temporarily fixed thereto to a predetermined temperature lower than the melting temperature of the solder, to vaporize the temporary fixing agent
Implementation Method 2
a reduction step, performed concurrently with or after the vaporization step, of reducing, with a reducing gas at a predetermined temperature lower than the melting temperature of the solder, the solder and the soldering target left in the vaporization step
Implementation Method 3
a solder melting step, performed after the reduction step, of heating the soldering target to a predetermined temperature equal to or higher than the melting temperature of the solder to melt the solder
Implementation Method 4
a vacuum breaking step, performed after the solder melting step, of increasing pressure to break the vacuum in order to compress or eliminate cavities or voids in the solder, wherein the solder is in a molten state in the vacuum breaking step
Implementation Method 5
a cooling step, performed after the vacuum breaking step, of cooling the soldering target, wherein the molten solder is cooled and solidified
Data Source
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AI summary
The present invention is a soldered product manufacturing method with which soldering can be performed without using a jig. This soldered product manufacturing method is provided with: a supplying step for supplying a solder and a temporary fixing agent for temporarily holding the solder; a temporary holding step for using the temporary fixing agent to temporarily hold the solder on an object to be soldered; a vaporizing step for placing the object to be soldered having the solder temporarily held thereon in a vacuum or heating the same to a prescribed temperature that is lower than the temperature at which the solder melts to thereby vaporize the temporary fixing agent and create a gap between the solder and the object to be soldered; a reducing step for, in parallel with the vaporizing step or thereafter, using a reduction gas to reduce the solder and object to be soldered remaining from the vaporizing step at a prescribed temperature that is lower than the temperature at which the solder melts; and a solder melting step for, following the reducing step, melting the solder by heating the object to be soldered to a prescribed temperature that is at least the temperature at which the solder melts.