Joined Superconductive Articles Low-Profile Splice
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Solution Overview
Problem
The commercialization of high-temperature superconductors is hindered by challenges in fabricating long, commercially viable superconducting tapes for power components, including engineering and manufacturing issues related to joining superconductor segments, which affects their power-handling capacity, size, environmental impact, and safety.
Innovation Solution
A superconducting article with a layered structure comprising a metal-based substrate, a biaxially textured buffer layer, a high-temperature superconductor layer, and a stabilizer layer, where the segments are joined using a low-profile splice structure with reduced thickness end portions and a bond layer, such as Indium solder, to achieve low joint resistance and mechanical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If superconductor segments are joined using conventional methods, then electrical connectivity is achieved, but joint resistance increases and mechanical stability deteriorates
Solution Approach 1:
A copper interlayer is introduced as an intermediary between the superconductor segment and the stabilizer layer. This copper interlayer serves as a mediator that improves electrical connectivity and reduces joint resistance at the interface, while also enhancing mechanical bonding stability without significantly increasing structural complexity
Solution Approach 2:
The thickness of the copper interlayer is optimized to specific ranges (5-20 micrometers) to achieve the best balance between electrical conductivity and mechanical properties. By controlling the copper layer thickness parameter, the joint resistance is minimized while maintaining structural integrity
2Productivity
If long superconducting tapes are produced by joining segments, then commercial viability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The long superconducting tape is divided into manageable segments that can be manufactured separately and then joined together. This segmentation allows for standardized production processes on each segment while achieving long overall lengths through controlled joining of multiple segments using the simplified copper interlayer method
Solution Approach 2:
The copper interlayer acts as a mediator that simplifies the joining process between segments. It provides a straightforward bonding interface that reduces manufacturing complexity compared to conventional joining methods, enabling easier assembly of long tapes from multiple segments
3Strength
If reduced thickness end portions are used in splicing, then mechanical stability improves, but manufacturing precision requirements increase
Solution Approach 1:
The thickness of the copper interlayer is controlled within specific ranges (5-20 micrometers) to optimize both mechanical stability and ease of manufacture. This parameter control provides clear manufacturing guidelines that balance the need for reduced thickness with achievable precision levels
Solution Approach 2:
The splice structure uses a composite of superconductor material and copper interlayer, where the copper provides mechanical stability and electrical connectivity. This composite approach allows the reduced thickness design to achieve improved mechanical properties while the copper layer compensates for precision variations through its ductile properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of long, high-dimension-ratio superconducting tapes with low joint resistance and improved mechanical stability, suitable for power transmission and distribution, reducing material and manufacturing costs, and enhancing the feasibility of high-temperature superconductor applications in the power industry.
Implementation Method 1
the segments are joined using a low-profile splice structure with reduced thickness end portions and a bond layer, such as Indium solder, to achieve low joint resistance and mechanical connectivity
Implementation Method 2
high-temperature (high-T c ) superconductors have been discovered... YBa 2 Cu 3 O 7-x (YBCO)... having superconductive properties at a temperature above that of liquid nitrogen (77 K)
Implementation Method 3
a biaxially textured buffer layer
Data Source
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Figure 5~6
AI summary
A superconducting article includes a first superconductive segment having a nominal thickness tn1, a second superconductive segment having a nominal thickness tn2, and a joint region comprising a splice connecting the first and second superconductive segments together. The splice overlies portions of both the first and second superconductive segments along the joint region, the joint region having a thickness tjr, wherein tjr is not greater than at least one of 1.8tn1 and 1.8tn2.