Component Joining Apparatus Thermal Expansion Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing component joining techniques suffer from reduced positioning accuracy due to thermal expansion differences between joining parts and the substrate during high-temperature soldering, leading to inaccuracies in component placement.
Innovation Solution
A component joining apparatus and method that employs a heating stage with a defined heating region for the substrate, where the substrate is larger than the heating stage, and a non-heating region that does not contact the heating stage, minimizing thermal expansion displacement by floating the non-heating region in the air, and using rapid heating and cooling processes to solidify the solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is heated at high temperature to join the component, then the solder melts and joining is achieved, but the substrate undergoes thermal expansion causing positioning accuracy to deteriorate
Solution Approach 1:
The substrate is divided into a heating region that contacts the heating stage and a non-heating region that is suspended in air. This segmentation allows only the necessary area to be heated for solder melting while isolating other areas from thermal expansion, thus maintaining positioning accuracy during the joining process
Solution Approach 2:
Different regions of the substrate are given different thermal properties: the heating region is designed to contact the heating stage for localized heating to melt solder, while the non-heating region is designed to be thermally isolated. This local differentiation enables joining reliability in the heating region without compromising positioning accuracy in the non-heating region
2Reliability
If the entire substrate is heated to melt the solder, then joining is achieved, but the cooling time increases reducing productivity
Solution Approach 1:
The substrate is segmented into heating and non-heating regions, so only the heating region requires cooling after solder melting. This reduces the total volume that needs cooling, thereby shortening cooling time and improving productivity while maintaining joining reliability in the heated region
Solution Approach 2:
The heating is applied periodically and locally to the heating region rather than continuously to the entire substrate. This allows for rapid heating and cooling cycles in the heating region while the non-heating region remains at ambient temperature, reducing overall cooling time and increasing productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes positional errors caused by thermal expansion, ensuring accurate and precise component positioning and mounting on the substrate while maintaining high productivity by reducing cooling time.
Implementation Method 1
a heating stage heating and holding a substrate
Implementation Method 2
melting the solder to join the component
Implementation Method 3
cooling the solder to join the component
Implementation Method 4
the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage
Data Source
AI summary
A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.