Joint Inspection Apparatus Multi-Feature Solder Analysis

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Solution Overview

Problem

Current methods for judging the quality of solder connections between electronic components and printed circuit boards are unreliable due to reliance on single volume measurements, which are affected by various factors, and require cumbersome user interface adjustments through trial and error.

Innovation Solution

A joint inspection apparatus that combines three-dimensional and two-dimensional shape measurements, classifies joint states using multiple features, and provides an intuitive user interface for adjusting reference criteria, displaying results in a feature space graph to enhance accuracy and usability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If joint volume measurement is used to judge connection quality, then the inspection process is simple, but the judgment reliability is low

Engineering Contradiction:
Improveinspection process complexityVSAvoidjoint judgment reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent segments the joint inspection into multiple feature dimensions: volume measurement, area measurement, and height measurement. Each dimension provides independent information about the joint quality, and their combination enables comprehensive judgment. This segmentation resolves the contradiction by maintaining procedural simplicity through automated multi-parameter measurement while significantly improving reliability through diverse measurement perspectives.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from single-dimensional volume measurement to multi-dimensional inspection by incorporating area and height measurements. This dimensional expansion allows the system to capture comprehensive joint characteristics, resolving the contradiction by maintaining operational simplicity while achieving reliable judgment through enhanced measurement dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If multiple joint features are extracted and analyzed, then the judgment accuracy is improved, but the device complexity increases

Engineering Contradiction:
Improvejoint state judgment accuracyVSAvoidmeasurement and analysis system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a multi-functional measurement system that simultaneously performs volume, area, and height measurements using integrated sensors and processing units. This universal approach resolves the contradiction by achieving high judgment accuracy through multiple features while avoiding excessive complexity through functional integration and coordinated operation of measurement components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent replaces complex manual inspection mechanisms with automated optical or electromagnetic sensing systems that can simultaneously extract multiple joint features. This substitution resolves the contradiction by achieving accurate multi-parameter measurement and analysis while reducing mechanical complexity through electronic and computational systems.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If user interface requires trial and error for optimizing reference, then the system is simple to implement, but the ease of operation deteriorates

Engineering Contradiction:
Improvesystem implementation simplicityVSAvoidreference optimization convenience
Core Design Contradiction:
Ease of manufactureVSEase of operation

Solution Approach 1:

The patent implements self-service functionality where the system automatically optimizes reference values and judgment criteria based on the measured joint features. The system performs self-calibration and adaptive learning, eliminating the need for manual trial-and-error adjustment. This resolves the contradiction by maintaining implementation simplicity while dramatically improving operational convenience through automated optimization.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent incorporates feedback mechanisms where measurement results are continuously analyzed and used to automatically adjust reference values and judgment thresholds. This closed-loop system resolves the contradiction by maintaining simple implementation while achieving ease of operation through automated feedback-driven optimization that eliminates manual intervention.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS9091668B2Joint inspection apparatus
Publication Date: 2015.07.28 KOHYOUNG TECH
  • US9091668B2 patent drawing
  • US9091668B2 patent drawing
  • US9091668B2 patent drawing

AI summary

Disclosed herein is a joint inspection apparatus for judging whether an electronic component mounted on a board is appropriately soldered to the board capable of increasing accuracy in judging a state of a joint by combining at least two joint features with each other and capable of allowing a user to intuitively and easily change a reference for judging the state of the joint. The joint inspection apparatus includes: a three-dimensional shape measuring device measuring joint features; a classifying device judging a state of a joint by at least two joint features transmitted by the three-dimensional shape measuring device; and a user interface device displaying the state of the joint, wherein the state of the joint is displayed in a joint space graph in which a user may easily adjust a judgment reference.