Josephson Junction Fabrication via Mask Channel Evaporation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for preparing Josephson junctions in superconducting quantum chips require high-resolution photoetching equipment, which is costly and slow, and do not allow for flexible adjustment of junction size without altering the line width.
Innovation Solution
A method involving the use of a mask with intersecting channels to form Josephson junctions by controlling evaporation directions, allowing the junction area to be adjusted without needing high-resolution devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-resolution photoetching equipment is used to prepare Josephson junctions, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent introduces a mask layer as an intermediary component between the photoetching process and the final Josephson junction structure. This mask layer with controlled channels enables precise junction formation through material deposition and removal, reducing the direct reliance on high-resolution photoetching equipment for defining the final junction geometry.
Solution Approach 2:
The preparation process is segmented into distinct steps: forming a mask layer with channels, depositing superconducting materials through the channels, and selectively removing portions. This segmentation allows each step to be performed with lower precision requirements individually, while achieving high overall precision through the coordinated sequence.
2Manufacturing precision
If high-resolution photoetching equipment is used, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The mask layer is prepared in advance with pre-defined channels that will guide subsequent material deposition. This preliminary action allows the actual Josephson junction formation to proceed more quickly through simple deposition and removal steps, rather than requiring high-resolution patterning during the final junction creation step.
Solution Approach 2:
The patent transitions from two-dimensional planar patterning to three-dimensional structured fabrication by utilizing vertical channel structures in the mask layer. This dimensional change enables precision control through the channel geometry and material deposition thickness rather than relying solely on lateral photoetching resolution.
3Device complexity
If line width is kept constant, then device structure is simplified, but adaptability deteriorates
Solution Approach 1:
The mask layer channel dimensions are made variable rather than fixed, allowing the Josephson junction area to be dynamically adjusted by changing the channel width or length in subsequent fabrication batches. This enables flexible adaptation of junction sizes while maintaining the same basic fabrication process and equipment setup.
Solution Approach 2:
The patent enables adjustment of the Josephson junction area by changing geometric parameters of the mask layer channels (width, length, orientation) rather than requiring changes to the photoetching line width. This parameter flexibility allows diverse junction sizes to be fabricated using the same equipment and process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible adjustment of Josephson junction area without requiring high-resolution equipment, reducing manufacturing costs and improving production efficiency.
Implementation Method 1
forming a strip-shaped first superconducting layer on one side, away from an evaporation source, in the first channel in a first evaporation direction
Data Source
AI summary
The present application discloses a Josephson junction preparation method and a Josephson junction, wherein a mask is provided with a first channel and a second channel, one end of the second channel coincides with the first channel, and a three-end channel is formed; a strip-shaped first superconducting layer is formed on the side, away from the evaporation source, in the first channel in the first evaporation direction; an included angle is formed between the first evaporation direction and the surface normal of the substrate, and the first evaporation direction enables the first superconducting layer to be only arranged in the first channel; a second superconducting layer is arranged in the second channel in the second evaporation direction, and forming a Josephson junction in the overlapped area of the first channel and the second channel.