Josephson Junction Mask Patterns for Faster Lift-Off Processing
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Solution Overview
Problem
The existing methods for manufacturing Josephson junction devices face challenges in efficiently removing the mask layer, leading to prolonged processing times and increased costs due to the limited entry routes for the peeling solution, which can adversely affect the characteristics of the device.
Innovation Solution
A manufacturing method involving the formation of a mask layer with specific mask patterns and oblique film deposition techniques to control the entry points for the peeling solution, allowing for the formation of Josephson junction devices with reduced processing times and improved positional freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask layer is used for oblique vapor deposition to form superconducting films, then the Josephson junction device can be manufactured with precise pattern control, but the lift-off processing time is prolonged due to limited entry routes for the peeling solution
Solution Approach 1:
The mask layer is divided into multiple regions with different opening sizes: a first region with a first opening for peeling solution entry, and a second region with a second opening larger than the first opening. This segmentation allows the peeling solution to enter through multiple pathways, significantly reducing lift-off time while maintaining pattern control precision during deposition
Solution Approach 2:
The invention introduces an additional dimensional aspect to the mask layer by creating openings of different sizes in different regions. The larger second opening provides an enhanced entry route for the peeling solution, adding a new pathway dimension that accelerates the lift-off process without compromising the precision achieved during the vapor deposition phase
2Device complexity
If the mask layer has a single opening for pattern formation, then the device structure is simple, but the lift-off process is inefficient due to limited peeling solution access
Solution Approach 1:
The mask layer is segmented into functional regions: a first region with a smaller opening for maintaining structural simplicity and a second region with a larger opening for enhanced peeling solution access. This segmentation improves manufacturing efficiency by enabling faster lift-off while keeping the overall mask layer design relatively simple
Solution Approach 2:
The mask layer is designed with multi-functionality: the first opening serves both as a pattern definition feature and a peeling solution entry route, while the second opening primarily serves as an enhanced peeling solution access point. This multi-functional design improves productivity without significantly increasing device complexity
3Device complexity
If oblique vapor deposition is performed from a single direction, then the film formation process is simple, but the positional freedom for forming overlapping superconducting film regions is limited
Solution Approach 1:
The invention introduces dynamic flexibility to the film formation process by enabling oblique vapor deposition from multiple directions. The mask layer design with openings in different regions allows the deposition source to approach from different angles, providing positional freedom for forming overlapping superconducting film regions while maintaining process simplicity
Solution Approach 2:
The invention adds a directional dimension to the film formation process. By creating openings in different regions of the mask layer, the process allows deposition from multiple directions, enabling the formation of complex overlapping patterns that require precise positional control without significantly increasing process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly shortens the lift-off processing time, reduces manufacturing costs, and maintains the integrity of the Josephson junction devices by ensuring controlled deposition and removal of superconducting films.
Implementation Method 1
a process of removing the mask layer by lift-off
Implementation Method 2
a process of forming a first superconducting film above the substrate in the first mask pattern, by first film formation from obliquely above the substrate, as using the mask layer as a mask, a process of forming an insulating film above a surface of the first superconducting film, a process of forming a second superconducting film that has a region that overlaps the first superconducting film via the insulating film in the first mask pattern, by second film formation from obliquely above the substrate
Data Source
AI summary
a method for manufacturing a Josephson junction device includes forming a mask layer, on a substrate, that includes a first mask pattern that has a first opening that extends in a first direction and a second opening that extends in a second direction that intersects with the first direction and a second mask pattern that has a third opening that is shorter than the second opening in the first direction and in the second direction, forming a first superconducting film above the substrate in the first mask pattern, by first film formation from obliquely above the substrate, forming an insulating film above a surface of the first superconducting film, forming a second superconducting film that has a region that overlaps the first superconducting film via the insulating film in the first mask pattern, by second film formation from obliquely above the substrate, and removing the mask layer by lift-off.