Josephson Junction Layout for Uniform Qubit Characteristics

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Variations in characteristics among qubits in quantum operation devices lead to inconsistent coherence times, making stable quantum operations challenging.

Innovation Solution

A superconducting circuit design incorporating a Josephson device with specific manufacturing methods using vapor deposition masks to align the incident angles of evaporation substances uniformly across the substrate, ensuring consistent shapes and reducing variations among qubits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional vapor deposition methods are used without aligned masks, then manufacturing process is simpler, but variations in qubit characteristics increase due to inconsistent incident angles

Engineering Contradiction:
Improvequbit characteristic consistencyVSAvoidmask alignment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces alignment marks as intermediary elements that mediate between the substrate and vapor deposition masks. These marks provide a reference framework that enables precise mask positioning, thereby ensuring consistent incident angles across all qubits without requiring complex direct measurement or adjustment systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements preliminary alignment mark formation on the substrate before mask deposition. By pre-establishing the alignment reference system, the incident angle consistency is ensured from the outset of the vapor deposition process, eliminating the need for post-processing adjustments or complex real-time alignment mechanisms.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If multiple separate deposition steps are used for different layers, then manufacturing precision is improved, but productivity decreases

Engineering Contradiction:
Improvelayer thickness controlVSAvoidmanufacturing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent combines multiple vapor deposition operations into a single integrated process sequence. By maintaining mask alignment and performing successive layer depositions without removing or realigning masks between steps, the system achieves both precise layer thickness control and improved manufacturing throughput through process consolidation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent enables continuous vapor deposition operations by maintaining mask placement throughout the multi-layer formation process. The aligned masks remain in position while different materials are deposited sequentially, eliminating idle time associated with mask removal and realignment, thus sustaining continuous productive action throughout the manufacturing process.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method suppresses variations in qubit characteristics, enhancing stability and coherence times, and improves manufacturing throughput.

Implementation Method 1

a Z-axis direction of the substrate is parallel to a traveling direction of an evaporation substance emitted from a vapor deposition source

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Data Source

PatentEP4471830B1Superconducting circuit including a josephson element, quantum computation device, and method for manufacturing the josephson element
Publication Date: 2025.12.10 FUJITSU LTD
  • EP4471830B1 patent drawingFigure 1
  • EP4471830B1 patent drawingFigure 2
  • EP4471830B1 patent drawingFigure 3

AI summary

A Josephson device includes: a first superconducting metal layer that includes a first surface; a second superconducting metal layer that includes a second surface that faces the first surface; and an insulating layer provided between the first surface and the second surface, and an outline of the second surface is inside an outline of the first surface in a plan view from a direction perpendicular to the first surface.