Jumper Chip Interconnect for Semiconductor Package Wire Reliability
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Solution Overview
Problem
The yield and quality of semiconductor device packages are limited due to the small size and fragile nature of semiconductor chips, leading to interference between bonding wires and components, which affects the overall performance and reliability of the devices.
Innovation Solution
A semiconductor device package is designed with a substrate, a first chip, a jumper chip, and multiple bonding wires, where the jumper chip with metal pads provides support and connection between the first chip and the substrate, using second bonding wires to connect the metal pads to the substrate's contact pads, enhancing the structural integrity and flexibility of wire connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are disposed over a semiconductor chip for interconnection, then electrical connection between components is achieved, but the bonding wires become weakened and prone to contact with the chip or other bonding wires, causing interference and deteriorating package quality
Solution Approach 1:
A jumper chip is introduced as an intermediary component between the semiconductor chip and the substrate. The jumper chip carries bonding wires that connect to contact pads on the substrate, eliminating the need for bonding wires to pass directly over the semiconductor chip. This mediator approach resolves the interference problem while maintaining electrical connectivity.
Solution Approach 2:
The interconnection structure is segmented into two separate connection paths: one set of bonding wires connects the semiconductor chip to the jumper chip, and another set connects the jumper chip to the substrate. This segmentation isolates the bonding wires from direct contact with the semiconductor chip, preventing interference and improving reliability.
2Area of moving object
If the semiconductor chip size is reduced to meet miniature electronic device requirements, then device miniaturization is achieved, but the chip becomes more fragile and yield is limited
Solution Approach 1:
The jumper chip serves as a mechanical and electrical intermediary that supports the bonding wires away from the fragile semiconductor chip. This allows the use of smaller, more fragile chips without compromising the overall package reliability, as the jumper chip absorbs the mechanical stress and provides a stable connection platform.
Solution Approach 2:
The jumper chip provides beforehand cushioning by carrying the bonding wires and isolating them from potential contact with the semiconductor chip. This protective arrangement is established before any potential interference can occur, ensuring that even small, fragile chips can be used with high yield and quality.
3Ease of operation
If a jumper chip with metal pads is introduced to provide support and connection for bonding wires, then wire connection flexibility and stability are improved, but device complexity increases
Solution Approach 1:
The jumper chip performs multiple functions: it provides mechanical support for bonding wires, establishes electrical connections between the semiconductor chip and substrate, and offers a platform for additional interconnections. This multi-functionality justifies the added component by consolidating several roles into a single element, reducing overall system complexity despite the additional part.
Data Source
AI summary
A semiconductor device package and a method of fabricating the same are provided. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.