Jumper Die Interconnect Across Scribe Lines Without Reticle Stitching
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Solution Overview
Problem
Conventional reticle stitching techniques for integrated circuit manufacturing are costly and require joint development with a target foundry, while 2.5D packaging using interposers increases manufacturing costs and may not naturally interface with different components due to form factor and electrical specification differences.
Innovation Solution
The use of a jumper die that is vertically attached to adjacent integrated circuit dies across a scribe line, allowing for interconnection without reticle stitching or interposers, using microbumps or hybrid bonds for electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional reticle stitching techniques are used to interconnect integrated circuit die, then desired functionality and performance are achieved, but manufacturing cost increases and yield is impacted
Solution Approach 1:
A jumper die is introduced as an intermediary component between adjacent integrated circuit die that need to be interconnected. The jumper die includes conductive pads on its top surface that electrically connect to corresponding conductive pads on adjacent die, enabling signal transmission across reticle boundaries without requiring complex reticle stitching techniques. This mediator approach simplifies the manufacturing process while maintaining the desired interconnect functionality.
Solution Approach 2:
The interconnection function is segmented into separate components: the adjacent integrated circuit die remain relatively simple, while the jumper die carries the interconnect functionality. This segmentation allows each component to be manufactured independently using standard processes, avoiding the need for expensive joint development with target foundries that would be required for reticle stitching.
2Adaptability or versatility
If 2.5D packaging techniques using an interposer are used to facilitate connections between different components, then electrical interface routing is provided, but manufacturing cost substantially increases
Solution Approach 1:
The jumper die serves as a simplified intermediary component compared to traditional interposers. It provides the necessary electrical interface routing between adjacent die without requiring the complex substrate and routing infrastructure of 2.5D packaging. The jumper die can be directly attached to the die using microbumps or hybrid bonding, eliminating the need for expensive interposer substrates and complex reflow processes.
Solution Approach 2:
The jumper die is designed as a simple, cost-effective interconnection component that can be manufactured using standard semiconductor processes. Rather than using expensive interposer substrates with complex routing, the jumper die provides a straightforward electrical connection solution that is easier and cheaper to manufacture while still achieving the desired adaptability for connecting different components.
3Ease of operation
If reticle stitching is used to achieve desired functionality, then interconnect lines can cross reticle boundaries, but additional reticle sets are required which increases manufacturing cost
Solution Approach 1:
The jumper die acts as a mediator that enables interconnect capability across reticle boundaries without requiring the adjacent die to have complex stitching patterns. The jumper die includes the necessary conductive pads and interconnect structures, allowing standard reticle designs to be used for the adjacent die while maintaining full interconnect functionality through the jumper die.
Solution Approach 2:
The interconnect complexity is extracted from the adjacent integrated circuit die and placed into the jumper die. This allows the adjacent die to be manufactured using simple, standard reticle designs without the need for overlapping images, oversized structures, or multiple reticle sets. The jumper die is then attached to provide the interconnect functionality that would otherwise require complex reticle stitching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and time-to-market by eliminating the need for reticle stitching and interposers, while enabling efficient interconnection of multiple die products without reliance on specialized foundries.
Implementation Method 1
The first conductive pad of the front side of the jumper die is connected to a corresponding conductive pad of a front side of the first integrated circuit die vertically with respect the front side of the first integrated circuit die and the front side of the jumper die using a microbump or a hybrid bond
Data Source
AI summary
A technique for interconnecting integrated circuit die of a substrate uses a jumper die that is vertically attached to adjacent integrated circuit die thereby coupling the adjacent die across a scribe line adjacent to the integrated circuit die. In an embodiment, an integrated circuit product includes a first integrated circuit die having a first die interface, a second integrated circuit die having a second die interface, a scribe line of a first surface of a semiconductor substrate, and a jumper die coupled to the first die interface and coupled to the second die interface. The jumper die spans the scribe line. A first portion of the jumper die is stacked with a first portion of the first integrated circuit die and a second portion of the jumper die is stacked with a first portion of the second integrated circuit die.