Vehicle Junction Box Heat Dissipation via Thermal Wall
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Solution Overview
Problem
Conventional electrical junction boxes on vehicles face heat concentration issues when the printed wiring board is positioned above the relay, leading to undesirable heat buildup on the wiring board due to the vertical overlap of covers.
Innovation Solution
The electrical junction box design includes a printed wiring board with a heat-introducing wall on its surface, guiding heat away from the board through a hole in the upper cover and providing a heat-insulating layer to prevent heat transmission, while also featuring a through-hole in the lower cover for water discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the printed wiring board is positioned above the relay mounted on the printed wiring board, then the space utilization is improved, but the heat generated by the relay concentrates on the printed wiring board
Solution Approach 1:
A heat-introducing wall is introduced as an intermediary structure between the relay and the printed wiring board. This wall extends from the inner edge of the hole in the upper cover downward, creating a thermal barrier that redirects heat away from the printed wiring board while preserving the vertical stacking arrangement for space efficiency
Solution Approach 2:
The solution moves the heat management approach from a two-dimensional plane (flat board layout) to a three-dimensional structure by introducing a vertical heat-introducing wall that extends downward from the upper cover, utilizing the vertical dimension to redirect heat flow away from the printed wiring board
2Volume of moving object
If the upper and lower covers overlap vertically, then the compactness is improved, but the heat generated by electric components concentrates on the printed wiring board
Solution Approach 1:
The heat-introducing wall serves as a thermal intermediary structure that intercepts heat rising from the relay and redirects it through the hole in the upper cover, preventing heat accumulation on the printed wiring board while maintaining the compact vertical overlap configuration of the covers
3Device complexity
If the printed wiring board covers the relay, then the integration is improved, but the heat generated by the relay cannot dissipate properly
Solution Approach 1:
The upper cover is segmented by introducing a hole through it, creating a dedicated heat dissipation pathway. The heat-introducing wall further segments the thermal flow, directing heat away from the printed wiring board and toward the hole for external dissipation, thus maintaining integration while enabling proper heat loss
Solution Approach 2:
The heat that would otherwise be harmful and cause concentration on the printed wiring board is converted into a beneficial outward flow. The heat-introducing wall and hole configuration channels the harmful heat generation from the relay into a controlled dissipation path, transforming the thermal problem into a managed heat flow solution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents heat concentration on the printed wiring board and ensures efficient heat dissipation, even when the covers overlap vertically, and prevents liquid from adhering to the board.
Implementation Method 1
a heat-introducing wall continued to an inner edge of the hole, and penetrating the printed wiring board... the heat generated by the relay concentrates on the printed wiring board
Implementation Method 2
providing a heat-insulating layer to prevent heat transmission
Implementation Method 3
a through-hole in the lower cover for water discharge... prevents liquid from adhering to the board
Data Source
AI summary
An electrical junction box 1 includes: a metallic substrate 24; a relay 25 mounted on a surface of the metallic substrate 24, and arranged lower than the metallic substrate 24; an upper cover 4 covering the metallic substrate 24, and arranged upper than the metallic substrate 24; a hole 17 opening on a surface of a ceiling wall 7 arranged parallel to the metallic substrate 24 of the upper cover 4; and a heat introducing tube 18 continued to an inner edge of the hole 17, and penetrating the metallic substrate 24.