Electrical Junction Box Resin-Fixed Coil for Compact Design

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Solution Overview

Problem

Conventional electrical junction boxes face challenges in reducing size and increasing circuit density due to the need for screw fixation, which complicates manufacturing and can cause stress-induced malfunctions in printed circuits.

Innovation Solution

A circuit assembly with a coil element fixed to a partition wall using synthetic resin material, allowing for increased wiring density and reduced size without the need for screw fixation regions on the circuit board, and incorporating a potting material for enhanced heat dissipation and magnetic field blocking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If screw fixation is used to mechanically fix the coil element, then the coil element is securely fixed, but the circuit board cannot be provided in the region around the screw and the size cannot be reduced

Engineering Contradiction:
Improvefixation strengthVSAvoidsize of electrical junction box
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The patent replaces the mechanical screw fixation system with a chemical bonding system using synthetic resin material. The coil element is fixed to the circuit board through adhesive bonding, eliminating the need for screw holes and associated fixation regions, thereby reducing the overall size while maintaining fixation strength

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fixation method from mechanical (screw) to chemical (adhesive), fundamentally altering the parameter of fixation mechanism. This allows the coil element to be securely fixed without requiring additional space for screw holes and fixation regions, enabling size reduction

Inventive Principle:
Principle #35Parameter changes

2Strength

If screw fixation is used to mechanically fix the coil element, then the coil element is securely fixed, but the manufacturing operation becomes complicated

Engineering Contradiction:
Improvefixation strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical screw fixation process with a simpler adhesive bonding process. This eliminates the need for drilling holes, threading, and fastening operations, significantly simplifying the manufacturing process while maintaining secure fixation

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent merges the fixation function with the circuit board structure itself by using the circuit board as the base for adhesive bonding. This integration eliminates separate fixation components and steps, simplifying manufacturing operations

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If screw fixation is used to mechanically fix the coil element, then the coil element is securely fixed, but stress is applied to the region around the screw on the board and causes malfunction of printed circuit

Engineering Contradiction:
Improvefixation strengthVSAvoidcircuit reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent replaces the mechanical screw fixation system with a chemical adhesive bonding system. This substitution distributes the fixation stress over a larger area through the adhesive layer, preventing stress concentration that would cause cracks in solder joints or malfunctions in the printed circuit, thereby improving reliability

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The adhesive material acts as a cushioning layer that absorbs and distributes mechanical stress before it reaches the circuit board and solder joints. This prevents stress-induced malfunctions and improves the overall reliability of the electrical junction box

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables easier manufacturing, reduced size, and improved heat dissipation while maintaining secure fixation of coil elements, allowing for higher circuit density and simplified assembly processes.

Implementation Method 1

the coil element is fixed to the partition wall using a synthetic resin material

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

the coil element is surrounded by the partition wall, and at least a portion of the coil element is embedded in the potting material provided in a space inward of the partition wall

Methodology Applied
Scientific EffectEmbedding:

Implementation Method 3

heat generated by the coil element is immediately transferred to the potting material and the partition wall and dissipated

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

The potting material may contain magnetic metal powder. With this configuration, a portion of the magnetic field generated by the coil element can be blocked by the magnetic metal powder

Methodology Applied
Scientific EffectMagnetic shielding: Magnetic Field

Data Source

PatentUS10297998B2Electrical junction box
Publication Date: 2019.05.21 AUTONETWORKS TECH LTD
  • US10297998B2 patent drawing
  • US10297998B2 patent drawing
  • US10297998B2 patent drawing

AI summary

An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.