Junction Box Heat Dissipation via Terminal Extension

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional electrical junction boxes face challenges in intensively dissipating heat from specific components, leading to increased design constraints and operational complexity due to the need for protruding features and heat transfer materials.

Innovation Solution

The electrical junction box design includes a heat-generating component positioned near the extension portion of a terminal, allowing for efficient heat dissipation through the terminal and connected wire, reducing the need for additional protrusions and simplifying the configuration while enhancing heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipation member is overlaid on the entire circuit board, then heat can be released overall, but heat cannot be intensively dissipated from a specific portion of the board

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidheat dissipation structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies local quality by positioning heat-generating components directly on the circuit board at locations requiring intensive heat dissipation, rather than using a uniform heat dissipation approach across the entire board. This allows targeted heat management where needed most.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent merges the heat-generating component with the circuit board by mounting it directly on the board, combining the functional component with the heat dissipation structure. This eliminates the need for separate protruding heat dissipation structures.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If protruding boss portions and protruding surfaces are added to transfer heat, then heat transfer efficiency improves, but design constraints and device complexity increase

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat-generating component directly with the circuit board, merging two previously separate elements (the component and the heat dissipation structure) into a single integrated assembly, thereby reducing structural complexity while maintaining heat transfer efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board serves multiple functions: it provides electrical connections and simultaneously acts as a heat dissipation structure through its thermal conductivity. This multi-functionality eliminates the need for dedicated protruding heat dissipation structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If heat transfer material is applied to protruding surfaces, then heat transfer reliability improves, but the number of operation steps and manufacturing complexity increase

Engineering Contradiction:
Improveheat transfer reliabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By merging the heat-generating component directly with the circuit board, the patent eliminates the need for separate heat transfer material application steps, reducing manufacturing complexity while maintaining reliable thermal contact through direct mounting.

Inventive Principle:
Principle #5Merging (Combining)

4Temperature

If precise positioning of protruding surfaces is ensured, then heat transfer effectiveness improves, but positioning accuracy requirements and manufacturing difficulty increase

Engineering Contradiction:
Improveheat transfer effectivenessVSAvoidpositioning accuracy
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent merges the heat-generating component with the circuit board in a way that utilizes the board's inherent structure for positioning, reducing the need for high-precision protruding features and complex positioning mechanisms.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables effective heat dissipation from heat-generating components, allowing for a more dense electronic component layout and reduced costs by eliminating the need for complex heat transfer structures, thus improving heat dissipation efficiency and reducing the size of the junction box.

Implementation Method 1

heat generated by the heat-generating component can be released via the extension portion of the terminal to the first board connected to the terminal

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS10763048B2Electrical junction box
Publication Date: 2020.09.01 AUTONETWORKS TECH LTD
  • US10763048B2 patent drawing
  • US10763048B2 patent drawing
  • US10763048B2 patent drawing

AI summary

An electrical junction box includes: a connector housing that is to be fitted to a mating connector housing; a terminal held by a terminal holding portion provided in the connector housing; a first board connected to an end portion on an extension portion side of the terminal, the extension portion extending from the terminal holding portion toward a direction opposite to a fitting direction; a second board facing the first board; and a heat-generating component installed on the second board in the vicinity of the extension portion.