Electrical Junction Box Via Blocking for Uniform Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation techniques for integrated circuits on printed substrates face issues with heat-conductive grease leakage, leading to variable heat dissipation performance due to uneven spreading.
Innovation Solution
An electrical junction box design featuring a circuit substrate with via holes blocked by a solid blocking member, a heat-transfer member on the main surface, and a heat dissipation member that contacts the heat-transfer member from the opposite side, preventing the heat-transfer member from entering the via holes and allowing it to spread evenly for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-conductive grease is applied between the surface pattern and integrated circuit, then heat dissipation is improved, but the grease may leak from conductor holes causing variable heat dissipation performance
Solution Approach 1:
The patent introduces a blocking member as an intermediary substance to fill conductor holes before applying heat-conductive grease. This blocking member prevents the grease from leaking into the holes while allowing thermal contact between the integrated circuit and surface pattern, thus maintaining consistent heat dissipation performance without the variability caused by grease leakage.
2Temperature
If heat-conductive grease is used to fill conductor holes, then heat transmission is improved, but the grease spreads unevenly affecting performance consistency
Solution Approach 1:
The patent applies the blocking member to fill the conductor holes before applying the heat-conductive grease. This preliminary action creates a barrier that prevents the grease from spreading into the holes, ensuring that the grease remains evenly distributed on the surface between the integrated circuit and surface pattern, thereby achieving uniform heat dissipation.
3Ease of manufacture
If via holes are left open in the circuit substrate, then manufacturing is simpler, but heat-transfer member leakage occurs reducing heat dissipation effectiveness
Solution Approach 1:
The patent extracts the problematic function of open via holes (which allow grease leakage) by introducing a blocking member that specifically addresses the leakage issue while maintaining the via hole structure. This allows the manufacturing process to remain simple while eliminating the harmful effect of grease entering the via holes and compromising heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent and enhanced heat dissipation performance by preventing heat-transfer member leakage into via holes, allowing it to spread effectively on the main surface, thereby efficiently dissipating heat from electrical components.
Implementation Method 1
a blocking member that blocks the via hole
Implementation Method 2
heat generated by the integrated circuit is transmitted to a back side pattern via the heat-conductive grease
Implementation Method 3
heat generated by the integrated circuit is transmitted to a back side pattern via the heat-conductive grease, and is dissipated
Data Source
AI summary
An object is to provide a technique that can make it easy to achieve favorable heat dissipation performance. An electrical junction box includes: a circuit substrate in which a via hole is formed; a blocking member that blocks the via hole; a heat-transfer member provided in a region of a main surface of the circuit substrate in which the via hole is formed; and a heat dissipation member that comes into contact with the heat-transfer member from the opposite side to the circuit substrate, wherein the blocking member is a solid member, and fills at least the main surface side of the via hole.