Light Transmissive Junction Layer for Display Gap and Repair
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Solution Overview
Problem
Existing display devices face challenges in preventing interference between rigid circuit boards and light transmissive substrates due to insufficient gaps, and the adhesives used are not suitable for repair, as they firmly bond the components together.
Innovation Solution
A display device design that incorporates a light transmissive junction layer with a core substrate, adhesive layer, and bonding layer, allowing for a sufficient gap between the circuit board and light transmissive substrate, enabling easy repair by separating the adhesion interface, while ensuring joint strength through a firmly coupled bonding interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a UV curing adhesive is used to bond the circuit board and light transmissive substrate, then the joint strength is improved, but the gap between the components becomes insufficient and interference occurs
Solution Approach 1:
The adhesive bonding structure is segmented into three distinct layers: a first adhesive layer for bonding to the circuit board, a core substrate providing structural thickness, and a second adhesive layer for bonding to the light transmissive substrate. This segmentation allows each layer to perform its specific function independently, achieving both sufficient gap and strong bonding.
Solution Approach 2:
The core substrate acts as an intermediary element between the two adhesive layers, providing the necessary gap thickness while being firmly bonded to both the circuit board and light transmissive substrate through the adhesive layers, thus preventing interference while maintaining joint strength.
2Strength
If a UV curing adhesive is used to firmly bond the components, then the joint strength is improved, but the ease of repair deteriorates
Solution Approach 1:
The adhesive bonding is divided into multiple separable interfaces (first adhesive layer and second adhesive layer), allowing the light transmissive substrate to be separated from the circuit board by detaching one layer without compromising the overall bonding structure, thus enabling easy repair while maintaining joint strength.
Solution Approach 2:
The first adhesive layer can be discarded or separated from the circuit board to enable removal of the light transmissive substrate for repair, while the second adhesive layer remains to maintain the bonding between the core substrate and the light transmissive substrate, facilitating easy repair while preserving joint strength.
3Ease of manufacture
If the light transmissive substrate is attached directly to the circuit board, then the manufacturing simplicity is improved, but the interference between the substrate and circuit board deteriorates
Solution Approach 1:
The attachment structure is segmented into multiple functional layers including the core substrate that provides physical separation and the adhesive layers that provide bonding, allowing the light transmissive substrate to be attached to the circuit board while preventing interference through the intermediate core substrate layer.
Solution Approach 2:
The core substrate serves as an intermediary element between the light transmissive substrate and the circuit board, providing sufficient gap to prevent interference while the adhesive layers ensure the entire assembly remains firmly attached as a unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a display device with a sufficient gap to prevent interference, allows for easy repair of the light transmissive substrate, and enhances joint strength, improving visibility by minimizing air bubble intrusion and refractive issues.
Implementation Method 1
the adhesive layer is adhered to one of the circuit board or the light transmissive substrate
Implementation Method 2
a UV curing adhesive that is cured by irradiation with light for bonding is used
Data Source
AI summary
A display device of the invention includes a display panel attached to one face side of a light transmissive circuit board and a light transmissive substrate attached to the other face side of the circuit board. A mounted component is mounted on the other face side of the circuit board. The circuit board includes a light transmissive junction layer for joining the circuit board to the light transmissive substrate at a position avoiding the mounted component. The junction layer includes a core substrate formed of a resin, an adhesive layer formed on one face of the core substrate, and a bonding layer formed on the other face of the core substrate and cured. The adhesive layer is adhered to the circuit board, and the bonding layer is firmly fixed to the light transmissive substrate.